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KIOXIA THGBMUG6C1LBAILRoHS

Manufacturer
KIOXIA
MPN
THGBMUG6C1LBAIL
LCSC Part #
C7509349
Packaging
BGA-153(13X11.5)
Customer #
Key Attributes
8GB eMMC 5.1 BGA-153(13X11.5) Memory (ICs) RoHS
Datasheetpdf iconKIOXIA THGBMUG6C1LBAIL
In-Stock: 266
266 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 45.3987$ 45.40
30+$ 43.3339$ 1300.02
Standard Packaging152/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory (ICs)
ManufacturerKIOXIA
PackagingBGA-153(13X11.5)
Memory Size8GB
Operating temperature-25℃~+85℃
Reading Speed in Sequence-
Writing Speed in Sequence-
FeaturesBuilt-in wear leveling function;Bad block management function;ECC error correction function
NAND Flash Type-
NAND Stand-By Current-
Controller Stand-By Current-
NAND Operating Voltage (VCCF)-
InterfaceeMMC 5.1
Controller Operating Voltage (VCCQ)1.7V~1.95V;2.7V~3.6V
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging152
Sales UnitPiece

Introduction

AI Translation

KIOXIA’s broad, high-performance lineup of e-MMC products integrates flash memory and an e-MMC controller in a single BGA package to perform functions such as error correction, wear leveling, logical-to-physical address translation, and bad-block management. These solutions support a high-speed memory interface compliant with JEDEC Version 5.0/5.1 and eliminate the need for the host to directly control the flash memory. e-MMC remains an important solution for many applications that are not able to migrate to the latest generation UFS, either because the densities needed are at the lower GB range, or because the processor does not yet support a UFS interface. Fabricated with solutions that utilize either 15nm process technology or more advanced BiCS FLASH 3D flash memory, e-MMC products are well-suited for a wide range of applications that continue to need e-MMC as an embedded memory solution.

Features

AI Translation
  • Easy adoption for SoCs
  • Widely supported MultiMediaCard (MMC) interface
  • Multiple boot partitions
  • Strong on-board ECC
  • Low power consumption
  • Small footprint
  • KIOXIA controller
  • Parallel interface BiCS FLASH 3D flash memory
  • Standard & extended temperature ranges
  • JEDEC standard (v5.0/v5.1) 11.5x13mm 153 ball BGA (11x10mm 4GB package option)

Applications

AI Translation
  • IoT devices
  • Smartphones
  • Smart TVs
  • Tablets/2-in-1
  • Automotive
  • Streaming Media
  • Smart Speakers