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KIOXIA THGBMUG6C1LBAIL

Fabricante
KIOXIA
Cód. da peça
THGBMUG6C1LBAIL
Nº LCSC
C7509349
Emb.
BGA-153(13X11.5)
Número do Cliente
Atrib. princ.
8GB eMMC 5.1 BGA-153(13X11.5) Memory
Folha de DadosKIOXIA THGBMUG6C1LBAIL
Garantia em cada pedido
100% Autêntico · Devolução ou Substituição em 30 Dias
Em estoque: 714
714 Em estoque, envio imediato
Mínimo: 1Múltiplo: 1Unidade de venda: Piece
Adicionar à Lista BOM
Qtd.Preço unit.Valor total
1+$ 49.961$ 49.96
10+$ 43.4655$ 434.66
30+$ 40.359$ 1210.77
100+$ 37.0415$ 3704.15
Encapsulamento Padrão152/Full Tray
Melhor preço para maior quantidade?
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Especificações do Produto

Tudo
TipoDescrição
CategoriaIntegrated Circuits (ICs)/Memory/Memory
FabricanteKIOXIA
Emb.BGA-153(13X11.5)
Operating Temperature-25℃~+85℃
FeaturesBuilt-in wear leveling function;Bad block management function;ECC error correction function
Memory Size8GB
Reading Speed in Sequence-
Writing Speed in Sequence-
NAND Flash Type-
NAND Stand-By Current-
Controller Stand-By Current-
NAND Operating Voltage (VCCF)-
InterfaceeMMC 5.1
Controller Operating Voltage (VCCQ)1.7V~1.95V;2.7V~3.6V
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Descrição

Tradução por IA

KIOXIA’s broad, high-performance lineup of e-MMC products integrates flash memory and an e-MMC controller in a single BGA package to perform functions such as error correction, wear leveling, logical-to-physical address translation, and bad-block management. These solutions support a high-speed memory interface compliant with JEDEC Version 5.0/5.1 and eliminate the need for the host to directly control the flash memory. e-MMC remains an important solution for many applications that are not able to migrate to the latest generation UFS, either because the densities needed are at the lower GB range, or because the processor does not yet support a UFS interface. Fabricated with solutions that utilize either 15nm process technology or more advanced BiCS FLASH 3D flash memory, e-MMC products are well-suited for a wide range of applications that continue to need e-MMC as an embedded memory solution.

Recursos

Tradução por IA
  • Easy adoption for SoCs
  • Widely supported MultiMediaCard (MMC) interface
  • Multiple boot partitions
  • Strong on-board ECC
  • Low power consumption
  • Small footprint
  • KIOXIA controller
  • Parallel interface BiCS FLASH 3D flash memory
  • Standard & extended temperature ranges
  • JEDEC standard (v5.0/v5.1) 11.5x13mm 153 ball BGA (11x10mm 4GB package option)

Aplicações

Tradução por IA
  • IoT devices
  • Smartphones
  • Smart TVs
  • Tablets/2-in-1
  • Automotive
  • Streaming Media
  • Smart Speakers