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Broadcom HSMF-C113 product image
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Broadcom HSMF-C113RoHS

Manufacturer
MPN
HSMF-C113
LCSC Part #
C6795902
Packaging
SMD-4P,2.5x1mm
Customer #
Key Attributes
Right Angle Tricolor Surface Mount Chip LEDs
Datasheetpdf iconBroadcom HSMF-C113
In-Stock: 3,039
3,039 In stock, ships now
Minimum: 1Multiple: 1Sales Unit: Piece
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 1.1232$ 1.12
10+$ 0.9453$ 9.45
30+$ 0.849$ 25.47
100+$ 0.738$ 73.80
500+$ 0.689$ 344.50
1,000+$ 0.6661$ 666.10
Standard Packaging3000/Full Reel
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Products Specifications

All
TypeDescription
CategoryOptoelectronics/LED Indication - Discrete
ManufacturerBroadcom
PackagingSMD-4P,2.5x1mm
Pitch-
Operating Temperature-40℃~+85℃
Diode ConfigurationCommon Anode
Length2.75mm
Dominant Wavelength - R620nm~635nm
ESD Withstand Voltage-
Height1.2mm
Dominant Wavelength - B460nm~475nm
Installation method-
Width1.2mm
Dominant Wavelength - G561.5nm~576.5nm
Lens ColorWhite Lens
Luminous Intensity - R28.5mcd~80mcd
Viewing Angle120°;125°
Luminous Intensity - B28.5mcd~60mcd
Luminous Intensity - G18mcd~50mcd
Peak Wavelength - R637nm
Peak Wavelength - B468nm
Lamp Holder Type-
Peak Wavelength - G570nm

Introduction

AI Translation

The HSMF-C113 / C115 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with reflow soldering and binned by both color and intensity.

Features

AI Translation
  • Common anode
  • Small 2.5x1.0x1.0 mm package
  • Diffused optics
  • Available in 8 mm tape on 7" diameter reels
  • High brightness using AlInGaP and InGaN die technology
  • Compatible with reflow soldering

Applications

AI Translation
  • Backlighting
  • Status indicator
  • Front panel indicator
  • Office automation
  • Home appliances
  • Industrial equipment