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MICROCHIP M7AFS600-1FGG484RoHS

Manufacturer
MPN
M7AFS600-1FGG484
LCSC Part #
C6586449
Packaging
FPBGA-484(23x23)
Customer #
Key Attributes
FPBGA-484(23x23) FPGAs (Field Programmable Gate Array) RoHS
Datasheetpdf iconMICROCHIP M7AFS600-1FGG484
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1+$ 334.3097$ 334.31
180+$ 313.9846$ 56517.23
480+$ 303.4926$ 145676.45
1,020+$ 298.3071$ 304273.24
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/FPGAs (Field Programmable Gate Array)
ManufacturerMICROCHIP
PackagingFPBGA-484(23x23)
Embedded Block RAM110592bit
Operating Temperature0℃~+70℃

Introduction

AI Translation

Actel Fusion mixed-signal FPGAs meet system architects' needs for simplified design and unleashed creativity. As the world's first mixed-signal programmable logic family, Fusion integrates mixed-signal analog, flash memory, and FPGA architecture into a single monolithic device. This technology leverages the unique properties of flash-based FPGAs — including high-isolation triple-well process and support for high-voltage transistors — to meet the stringent demands of mixed-signal system design. It opens new possibilities for system development, enabling designers to integrate a wide range of functions into a single device while providing the flexibility to upgrade late in the manufacturing process or after field deployment. The device offers an excellent alternative to costly and time-consuming mixed-signal ASIC design.

Features

AI Translation
  • Advanced 130 nm, 7-layer metal, Flash-based CMOS process
  • Non-volatile: program retained at power-off
  • Single-chip solution, ready at power-up
  • 350 MHz system performance
  • User Flash: 2 Mbits to 8 Mbits, configurable 8-bit, 16-bit, or 32-bit data path; 10 ns access time in pre-fetch mode
  • Additional 1 kbit FlashROM
  • Integrated ADC, up to 12-bit resolution, up to 600 ksps sample rate
  • Internal 2.56 V or external reference voltage
  • ADC supports up to 30 scalable analog input channels
  • High-voltage input tolerance: –10.5 V to +12 V
  • Current monitoring and temperature monitoring modules
  • Up to 10 MOSFET gate driver outputs; supports P-channel and N-channel power MOSFETs; programmable drive strength: 1 µA, 3 µA, 10 µA, 30 µA, and 20 mA
  • ADC accuracy better than 1%
  • Integrated 100 MHz RC oscillator (1% accuracy)
  • Crystal oscillator support (32 kHz to 20 MHz)
  • Programmable real-time counter
  • 6 clock conditioning circuits with 1 or 2 integrated PLLs; phase shift, frequency multiplication/division, and delay capability; input frequency 1.5~350 MHz, output frequency 0.75~350 MHz
  • Single 3.3 V supply with integrated on-chip 1.5 V regulator
  • Sleep and standby low-power modes
  • Secure in-system programming via JTAG with 128-bit AES encryption
  • FlashLock® technology for FPGA content protection
  • Mixed-voltage operation: 1.5 V, 1.8 V, 2.5 V, and 3.3 V
  • Per-bank I/O voltage selection, up to 5 banks per device
  • Multiple single-ended and differential I/O standards
  • Built-in I/O registers supporting 700 Mbps DDR operation
  • Hot-swap I/O support
  • Programmable output slew rate, drive strength, and weak pull-up/pull-down resistors
  • Pin-compatible packages across the entire Fusion family
  • Variable aspect ratio 4,608-bit SRAM blocks (×1, ×2, ×4, ×9, and ×18 configurations)
  • True dual-port SRAM (except ×18 configuration)
  • Programmable embedded FIFO control logic
  • M7 and M1 Fusion devices support soft ARM7 core