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MICROCHIP PIC24FJ64GA202-I/SO product image
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MICROCHIP PIC24FJ64GA202-I/SORoHS

Manufacturer
MICROCHIP
MPN
PIC24FJ64GA202-I/SO
LCSC Part #
C646657
Packaging
SOIC-28-300mil
Customer #
Key Attributes
General Purpose, 16-Bit Flash Microcontrollers with Cryptographic Engine, ISO 7816 and XLP Technology
Datasheetpdf iconMICROCHIP PIC24FJ64GA202-I/SO
In-Stock: 27
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QtyUnit PriceTotal Amount
1+$ 6.4922$ 6.49
10+$ 6.3222$ 63.22
30+$ 6.2099$ 186.30
100+$ 6.096$ 609.60
Standard Packaging27/Full Tube
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerMICROCHIP
PackagingSOIC-28-300mil
ADC (Bit)10bit;12bit
Operating Temperature-40℃~+85℃
Voltage - Supply2V~3.6V
Program Memory TypeFLASH
EEPROM-
Program Storage Size64KB
CPU CorePIC
Core Size16 Bit
CPU Maximum Speed32MHz
Oscillator TypeBuilt-in
Number of I/O21
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Features

AI Translation
  • AES Engine with 128, 192 or 256-Bit Key
  • Supports ECB, CBC, OFB, CTR and CFB128 modes
  • DES/Triple DES (TDES) Engine: Supports 2-Key and 3-Key EDE or DED TDES
  • Supports up to Three Unique Keys for TDES
  • Programmatically Secure
  • Pseudorandom Number Generator
  • True Random Number Generator
  • Non-Readable, On-Chip, OTP Key Storages
  • Multiple Power Management Options for Extreme Power Reduction:
    • VBAT allows the device to transition to a backup battery for the lowest power consumption with RTCC
    • Deep Sleep allows near total power-down with the ability to wake-up on internal or external triggers
    • Sleep and Idle modes selectively shut down peripherals and/or core for substantial power reduction and fast wake-up
    • Doze mode allows CPU to run at a lower clock speed than peripherals
  • Alternate Clock modes allow On-the-Fly Switching to a Lower Clock Speed for Selective Power Reduction
  • Extreme Low-Power Current Consumption for Deep Sleep:
    • WDT: 270 nA @3.3V typical
    • RTCC: 400 nA @ 32 kHz, 3.3V typical
    • Deep Sleep current: 40 nA, 3.3V typical
  • 10/12-Bit, 13-Channel Analog-to-Digital (A/D) Converter:
    • Conversion rate of 500 ksps (10-bit), 200 ksps (12-bit)
    • Conversion available during Sleep and Idle
  • Three Rail-to-Rail, Enhanced Analog Comparators with Programmable Input/Output Configuration
  • Three On-Chip Programmable Voltage References
  • Charge Time Measurement Unit (CTMU):
    • Used for capacitive touch sensing, up to 13 channels
    • Time measurement down to 100 ps resolution
    • Operation in Sleep mode
  • Up to Five External Interrupt Sources
  • Peripheral Pin Select (PPS); Allows Independent I/O Mapping of Many Peripherals
  • Five 16-Bit Timers/Counters with Prescaler:
    • Can be paired as 32-bit timers/counters
  • Six-Channel DMA supports All Peripheral modules:
    • Minimizes CPU overhead and increases data throughput
  • Six Input Capture modules, Each with a Dedicated 16-Bit Timer
  • Six Output Compare/PWM modules, Each with a Dedicated 16-Bit Timer
  • Enhanced Parallel Master/Slave Port (EPMP/EPSP)
  • Hardware Real-Time Clock/Calendar (RTCC):
    • Runs in Sleep, Deep Sleep and VBAT modes
  • Three 3-Wire/4-Wire SPI modules:
    • Support four Frame modes
    • Variable FIFO buffer
    • I2S mode
    • Variable width from 2-bit to 32-bit
  • Two I²C modules Support Multi-Master/Slave mode and 7-Bit/10-Bit Addressing
  • Four UART modules:
    • Support RS-485, RS-232 and LIN/J2602
    • On-chip hardware encoder/decoder for IrDA
    • Smart Card ISO 7816 support on UART1 and UART2 only:
      • T=0 protocol with automatic error handling
      • T=1 protocol
      • Dedicated Guard Time Counter (GTC)
      • Dedicated Waiting Time Counter (WTC)
      • Auto-wake-up on Auto-Baud Detect (ABD)
      • 4-level deep FIFO buffer
  • Programmable 32-Bit Cyclic Redundancy Check (CRC) Generator
  • Digital Signal Modulator provides On-Chip FSK and PSK Modulation for a Digital Signal Stream
  • High-Current Sink/Source (18 mA/18 mA) on All I/O Pins
  • Configurable Open-Drain Outputs on Digital I/O Pins
  • 5.5V Tolerant Inputs on Most Pins
  • Modified Harvard Architecture
  • Up to 16 MIPS Operation @32 MHz
  • 8 MHz Internal Oscillator:
    • 96 MHz PLL option
    • Multiple clock divide options
    • Run-time self-calibration capability for maintaining better than ±0.20% accuracy
    • Fast start-up
  • 17-Bit x 17-Bit Single-Cycle Hardware Fractional/Integer Multiplier
  • 32-Bit by 16-Bit Hardware Divider
  • 16x16-Bit Working Register Array
  • C Compiler Optimized Instruction Set Architecture (ISA)
  • Two Address Generation Units (AGUs) for Separate Read and Write Addressing of Data Memory
  • Supply Voltage Range of 2.0V to 3.6V
  • Two On-Chip Voltage Regulators (1.8V and 1.2V) for Regular and Extreme Low-Power Operation
  • 20,000 Erase/Write Cycle Endurance Flash Program Memory, Typical
  • Flash Data Retention: 20 Years Minimum
  • Self-Programmable under Software Control
  • Programmable Reference Clock Output
  • In-Circuit Serial Programming™ (ICSP™) and In-Circuit Emulation (ICE) via 2 Pins
  • JTAG Programming and Boundary Scan Support
  • Fail-Safe Clock Monitor (FSCM) Operation:
    • Detects clock failure and switches to on-chip, Low-Power RC Oscillator (LPRC)
  • Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
  • Separate Brown-out Reset (BOR) and Deep Sleep Brown-out Reset (DSBOR) Circuits
  • Programmable High/Low-Voltage Detect (HLVD)
  • Flexible Watchdog Timer (WDT) with its Own RC Oscillator for Reliable Operation
  • Standard and Ultra Low-Power Watchdog Timers (ULPWs) for Reliable Operation in Standard and Deep Sleep modes