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Infineon/CYPRESS CYUSB3014-BZXIRoHS

Manufacturer
MPN
CYUSB3014-BZXI
LCSC Part #
C57294
Packaging
BGA-121
Customer #
Key Attributes
SuperSpeed USB Controller
Datasheetpdf iconInfineon/CYPRESS CYUSB3014-BZXI
In-Stock: 2,932
2,932 In stock, ships now
Minimum: 1Multiple: 1Sales Unit: Piece
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QtyUnit PriceTotal Amount
1+$ 16.2847$ 16.28
10+$ 15.862$ 158.62
30+$ 14.7427$ 442.28
100+$ 13.7677$ 1376.77
Standard Packaging168/Full Tray
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Interface/Interface Controllers
ManufacturerInfineon/CYPRESS
PackagingBGA-121
Operating Temperature-40℃~+85℃
Voltage - Supply1.7V~3.6V
Number of ports-
Applications FunctionUSB to SPI;USB to UART;USB to I2C;USB to I2S
Data Rate5Gbps
USB ProtocolUSB 3.1;USB 2.0

Features

AI Translation
  • Universal serial bus (USB) integration
  • USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007)
  • 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1
  • High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
  • Thirty-two physical endpoints
  • Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection
  • General Programmable Interface (GPIF II)
  • Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices
  • 8-, 16-, 24-, and 32-bit data bus
  • Up to 16 configurable control signals
  • Fully accessible 32-bit CPU
  • ARM926EJ core with 200-MHz operation
  • 512-KB or 256-KB embedded SRAM
  • Additional connectivity to the following peripherals
  • SPI master at up to 33 MHz
  • UART support of up to 4 Mbps
  • I2C master controller at 1 MHz
  • I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz
  • Selectable clock input frequencies
  • 19.2, 26, 38.4, and 52 MHz
  • 19.2-MHz crystal input support
  • Ultra low-power in core power-down mode
  • Less than 60 μA with VBATT on and 20 μA with VBATT off
  • Independent power domains for core and I/O
  • Core operation at 1.2 V
  • I2S, UART, and SPI operation at 1.8 to 3.3 V
  • I2C operation at 1.2 V to 3.3 V
  • Package options
  • 121-ball, 10-×10-mm, 0.8-mm pitch Pb-free ball grid array (BGA)
  • 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP)
  • EZ-USB Software Development Kit (SDK) for code development of firmware and PC Applications
  • Includes RTOS Framework (using ThreadX Version 5)
  • Firmware examples covering all I/O modules
  • Visual Studio host examples using C++ and C#
  • SuperSpeed Explorer Board available for rapid prototyping
  • Several accessory boards also available: Adapter boards for Xilinx/Altera FPGA development, Adapter board for Video development, CPLD board for concept testing and initial development

Applications

AI Translation
  • Digital video camcorders
  • Digital still cameras
  • Printers
  • Scanners
  • Video capture cards
  • Test and measurement equipment
  • Surveillance cameras
  • Personal navigation devices
  • Medical imaging devices
  • Video IP phones
  • Portable media players
  • Industrial cameras
  • Data loggers
  • Data acquisition
  • High-performance Human Interface Devices (gesture recognition)