MICROCHIP CDLL6341D/TR
| Manufacturer | |
| MPN | CDLL6341D/TR |
| LCSC Part # | C5568976 |
| Packaging | DO-213AA |
| Customer # | |
| Key Attributes | 1 Independent 51V DO-213AA Single Zener Diodes |
| Datasheet |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/Zener/Single Zener Diodes | |
| Manufacturer | MICROCHIP | |
| Packaging | DO-213AA | |
| Diode Configuration | 1 Independent | |
| Tolerance | ±1% | |
| Operating Junction Temperature Range | -65℃~+175℃ | |
| Pd - Power Dissipation | 500mW | |
| Reverse Leakage Current (Ir) | 50nA@39V | |
| Impedance(Zzt) | 85Ω | |
| Zener Voltage(Range) | - | |
| Zener Voltage(Nom) | 51V | |
| Impedance(Zzk) | 1kΩ |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/Zener/Single Zener Diodes | |
| Manufacturer | MICROCHIP | |
| Packaging | DO-213AA | |
| Diode Configuration | 1 Independent | |
| Tolerance | ±1% | |
| Operating Junction Temperature Range | -65℃~+175℃ |
| Type | Description | |
|---|---|---|
| Pd - Power Dissipation | 500mW | |
| Reverse Leakage Current (Ir) | 50nA@39V | |
| Impedance(Zzt) | 85Ω | |
| Zener Voltage(Range) | - | |
| Zener Voltage(Nom) | 51V | |
| Impedance(Zzk) | 1kΩ |
Introduction
Zener diodes in leadless surface-mount packages featuring low reverse leakage and low noise characteristics, dual-plug construction with metallurgical bonding. Model range from CDLL6309 to CDLL6349. Junction and storage temperature range: -65°C to +175°C; DC power dissipation at TEC = +125°C: 500 mW; power derating above TEC = +125°C: 10 mW/°C; maximum forward voltage at 200 mA: 1.1 V. DO-213AA hermetic glass package (MELF, SOD-80, LL34); lead finish: tin/lead; maximum thermal resistance, junction to end cap: 100 °C/W. The striped (cathode) end is positive with respect to the other end during diode conduction. Mounting orientation is unrestricted; the axial coefficient of thermal expansion of the mounting surface should match the device's approximately +6 PPM/°C.
Features
- Leadless surface mount package
- Low reverse leakage characteristics
- Low noise characteristics
- Dual plug structure
- Metallurgical bonding
| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 84.3476 | $ 84.35 |
| 200+ | $ 33.6563 | $ 6731.26 |
| 500+ | $ 32.5305 | $ 16265.25 |
| 1,000+ | $ 31.9759 | $ 31975.90 |
Standard Packaging100/Full Reel | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/Zener/Single Zener Diodes | |
| Manufacturer | MICROCHIP | |
| Packaging | DO-213AA | |
| Diode Configuration | 1 Independent | |
| Tolerance | ±1% | |
| Operating Junction Temperature Range | -65℃~+175℃ | |
| Pd - Power Dissipation | 500mW | |
| Reverse Leakage Current (Ir) | 50nA@39V | |
| Impedance(Zzt) | 85Ω | |
| Zener Voltage(Range) | - | |
| Zener Voltage(Nom) | 51V | |
| Impedance(Zzk) | 1kΩ |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/Zener/Single Zener Diodes | |
| Manufacturer | MICROCHIP | |
| Packaging | DO-213AA | |
| Diode Configuration | 1 Independent | |
| Tolerance | ±1% | |
| Operating Junction Temperature Range | -65℃~+175℃ |
| Type | Description | |
|---|---|---|
| Pd - Power Dissipation | 500mW | |
| Reverse Leakage Current (Ir) | 50nA@39V | |
| Impedance(Zzt) | 85Ω | |
| Zener Voltage(Range) | - | |
| Zener Voltage(Nom) | 51V | |
| Impedance(Zzk) | 1kΩ |
Introduction
Zener diodes in leadless surface-mount packages featuring low reverse leakage and low noise characteristics, dual-plug construction with metallurgical bonding. Model range from CDLL6309 to CDLL6349. Junction and storage temperature range: -65°C to +175°C; DC power dissipation at TEC = +125°C: 500 mW; power derating above TEC = +125°C: 10 mW/°C; maximum forward voltage at 200 mA: 1.1 V. DO-213AA hermetic glass package (MELF, SOD-80, LL34); lead finish: tin/lead; maximum thermal resistance, junction to end cap: 100 °C/W. The striped (cathode) end is positive with respect to the other end during diode conduction. Mounting orientation is unrestricted; the axial coefficient of thermal expansion of the mounting surface should match the device's approximately +6 PPM/°C.
Features
- Leadless surface mount package
- Low reverse leakage characteristics
- Low noise characteristics
- Dual plug structure
- Metallurgical bonding
Compliance & Export Codes
| Type | Details |
|---|---|
| ECCN | EAR99 |
| CNHTS | 8541100000 |
| USHTS | 8541100040 |
| TARIC | 8541100000 |
| CAHTS | 8541100090 |
| BRHTS | 85411011 |
| INHTS | 85411000 |
| MXHTS | 8541.10.01 |
| Type | Details |
|---|---|
| ECCN | EAR99 |
| CNHTS | 8541100000 |
| USHTS | 8541100040 |
| TARIC | 8541100000 |
| Type | Details |
|---|---|
| CAHTS | 8541100090 |
| BRHTS | 85411011 |
| INHTS | 85411000 |
| MXHTS | 8541.10.01 |

