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Infineon BGSX 22GN10 E6327RoHS

Hersteller
Infineon
Herst.-Teilenr.
BGSX 22GN10 E6327
LCSC-Nr.
C534245
Verp.
DFN-10
Kundennummer
Hauptmerkm.
DFN-10 RF Switches RoHS
Datenblattpdf iconInfineon BGSX 22GN10 E6327
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Minimum: 1Vielfaches: 1Verkaufseinheit: Piece
Zur BOM-Liste hinzufügen
Stk.E-Preis(Nur als Referenz)Gesamtbetrag
1+$ 0.8412$ 0.84
200+$ 0.3257$ 65.14
500+$ 0.3149$ 157.45
1,000+$ 0.3087$ 308.70
Standardgehäuse7500/Full Reel
Besserer Preis bei größerer Menge?
$

Produktspezifikationen

Alle
TypBeschreibung
KategorieRF and Wireless/RF Switches
HerstellerInfineon
Verp.DFN-10
FeaturesIntegrated control logic
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KI-Übersetzung
  • World’s best SiGe:C technology enabling LNAs with the lowest NF, highest linearity and lowest power consumption
  • In-house 130 nm RFCMOS technology enabling switches for complex technology with the smallest size and lowest insertion loss
  • 2-layer leadframe package for complex systems and flexibility in design
  • Continuous investment in future technologies, leading in mmW application
  • In-house system expert team with a background in smartphone design
  • In-house system simulation capability
  • Antenna expertise
  • A twenty-fold improvement in antenna radiation efficiency
  • Carrier aggregation increases system bandwidth but requires hardware support
  • Thanks to their direct mapping and cross ports capability, Infineon’s BGSX2xxMA18 MIPI - controlled switches support up to 4CA and many different band combinations
  • Infineon’s BGS15MA12 with direct mapping can support up to 5CA
  • Adding a low - noise amplifier could typically increase system SNR by 3 dB, thereby increasing the date rate by up to 80 percent
  • Our high - power switch family can handle very high transmitting signal levels of up to 38 dBm, while at the same time exhibiting low losses to conserve battery power. These switches feature proprietary RF CMOS technology and combine low loss characteristics with high linearity for uplink carrier aggregation
  • The Low - noise amplifier Multiplex Module (LMM) simplifies the RF - front - end design and helps to reduce size, optimize costs, improve system performance, reduce time - to - market
  • The LMM components are the ideal choice for Downlink - Carrier Aggregation (DL - CA) and Uplink Carrier - Aggregation (UL - CA)
  • Up to 80 percent less number of routing lines + MIPI - controlled
  • Up to 50 percent smaller
  • Up to 60 percent BOM cost savings