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kinghelm KH-LF3225-N215RoHS

Manufacturer
kinghelmAsian Brands
MPN
KH-LF3225-N215
LCSC Part #
C53058862
Packaging
SMD
Customer #
Key Attributes
2.9dB 3.4GHz~3.8GHz SMD RF Directional Coupler RoHS
Datasheetpdf iconkinghelm KH-LF3225-N215
In-Stock: 20
20 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 1.8246$ 1.82
10+$ 1.5517$ 15.52
30+$ 1.3819$ 41.46
100+$ 1.2074$ 120.74
500+$ 1.1281$ 564.05
1,000+$ 1.0932$ 1093.20
Standard Packaging2500/Full Reel
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Products Specifications

All
TypeDescription
CategoryRF and Wireless/RF Directional Coupler
Manufacturerkinghelm
PackagingSMD
Features-
Width2.5mm
Insertion Loss2.9dB
Return Loss-
Coupling Factor-
Frequency Range3.4GHz~3.8GHz
Length3.2mm
Operating Temperature-40℃~+105℃
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Introduction

AI Translation

Microwave bandpass filters in the LF series are designed for WLAN, satellite TV, Bluetooth, low-noise downconverters, personal handyphone systems, and cordless telephone applications. This series features low insertion loss, high attenuation, and a compact SMD chip design that minimizes complex tuning requirements, simplifying circuit design.

Features

AI Translation
  • Product dimensions: 3.2×2.5×1.5 mm
  • Structure: Multi-layer filter
  • Operating temperature range: -40℃ ~ +105℃
  • Storage temperature range: -40℃ ~ +90℃
  • Vibration resistance: Electrical performance meets specifications after 2 hours of vibration in X, Y, and Z directions at 10~55Hz frequency and 1.5mm amplitude
  • Drop impact resistance: No mechanical damage after 3 free drops onto a hardwood board from a height of 100cm on each of the X, Y, and Z faces
  • Soldering heat resistance: Withstands preheating at 120~150℃ for 120 seconds, followed by immersion in solder at 255℃+10℃ for 5±0.5 seconds, or soldering with a 300℃-10℃ iron for 3±0.5 seconds, with no damage to soldering surfaces
  • Terminal adhesion strength: Electrode terminals or surfaces withstand a horizontal push force of 5N (size ≤0603) or 10N (size >0603) for 10±1 seconds with no significant appearance damage or electrode displacement
  • Bending resistance: When soldered at the center of a PCB with thickness 1.6±0.2mm or 0.8±0.1mm, bent to 1.5mm at 1mm/s and held for 5±1 seconds, no delamination of metal layers
  • Humidity resistance: Electrical performance meets specifications after 96 hours at 60±2℃ and 90~95% relative humidity, followed by 1~2 hours recovery at room temperature
  • High-temperature durability: Electrical performance meets specifications after 96±2 hours at 105±5℃, followed by 1~2 hours recovery at room temperature
  • Low-temperature durability: Electrical performance meets specifications after 96±2 hours at -40℃±5℃, followed by 1~2 hours recovery at room temperature
  • Temperature cycling: Electrical performance meets specifications after 5 cycles of 30 minutes each at -40℃ and +105℃, followed by 1~2 hours recovery at room temperature

Applications

AI Translation
  • Wireless LAN
  • Satellite TV
  • Bluetooth
  • Personal Handyphone System
  • Cordless Phone