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VISHAY THJP0603ABT1RoHS

Manufacturer
VISHAY
MPN
THJP0603ABT1
LCSC Part #
C5205336
Packaging
0603
Customer #
Key Attributes
0603 Pads, Sheets, Bridges RoHS
Datasheetpdf iconVISHAY THJP0603ABT1
In-Stock: 30
30 In stock, ships now
Minimum: 1Multiple: 1Sales Unit: Piece
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QtyUnit PriceTotal Amount
1+$ 0.7869$ 0.79
10+$ 0.7654$ 7.65
30+$ 0.7531$ 22.59
100+$ 0.7393$ 73.93
Standard Packaging3000/Full Reel
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Products Specifications

All
TypeDescription
CategoryFans, Blowers, Thermal Management/Thermal/Pads, Sheets, Bridges
ManufacturerVISHAY
Packaging0603
Features-
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Introduction

AI Translation

THJP surface mount chips are designed to provide electrically isolated thermal conduction paths to ground planes or heat sinks while maintaining the electrical isolation of the device. The device utilizes an aluminum nitride substrate and is available in both SnPb and lead-free wraparound termination styles. Its low capacitance characteristics make it ideal for high-frequency and thermal gradient applications. Custom sizes are also available.

Features

AI Translation
  • Electrically insulating thermal conductor
  • High thermal conductivity AlN substrate (170 W/mK)
  • Electrically insulating termination (> 999 MΩ)
  • Low capacitance
  • SnPb or lead-free wraparound termination available
  • AEC-Q200 qualified

Applications

AI Translation
  • Power Supplies and Converters
  • RF Amplifiers
  • Synthesizers
  • Switching Mode Power Supplies
  • PIN and Laser Diodes