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VISHAY SI7611DN-T1-GE3 product image
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VISHAY SI7611DN-T1-GE3RoHS

Manufacturer
MPN
SI7611DN-T1-GE3
LCSC Part #
C506599
Packaging
PowerPAK1212-8
Customer #
Key Attributes
40V 9.3A 3.7W 25mΩ@10V 1 P-Channel PowerPAK1212-8 Single FETs, MOSFETs RoHS
Datasheetpdf iconVISHAY SI7611DN-T1-GE3
In-Stock: 72
72 In stock, ships now
Minimum: 1Multiple: 1Sales Unit: Piece
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QtyUnit PriceTotal Amount
1+$ 2.6124$ 2.61
10+$ 2.3119$ 23.12
30+$ 2.1234$ 63.70
100+$ 1.9301$ 193.01
500+$ 1.8424$ 921.20
1,000+$ 1.805$ 1805.00
Standard Packaging3000/Full Reel
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Products Specifications

All
TypeDescription
CategoryDiscrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs
ManufacturerVISHAY
PackagingPowerPAK1212-8
Operating Temperature-50℃~+150℃
Drain to Source Voltage40V
Current - Continuous Drain(Id)9.3A
Gate Threshold Voltage (Vgs(th))-
Pd - Power Dissipation3.7W
Reverse Transfer Capacitance (Crss@Vds)175pF
RDS(on)25mΩ@10V
Number1 P-Channel
Input Capacitance(Ciss)1.98nF
Gate Charge(Qg)41nC@10V

Introduction

AI Translation

P-Channel 40 V (D-S) MOSFET, TrenchFET power MOSFET in a low thermal resistance PowerPAK 1212-8 package with a small footprint and low profile of 1.07 mm. The PowerPAK 1212-8 is a derivative of the PowerPAK SO-8, utilizing the same packaging technology to maximize die area. The exposed die attach pad on the bottom provides a direct low-resistance thermal path to the mounting substrate, delivering thermal performance on par with the PowerPAK SO-8. Its footprint is comparable to TSOP-6, more than 40% smaller than standard TSSOP-8, with more than twice the die capacity of standard TSOP-6. Thermal performance is an order of magnitude better than SO-8 and 20× better than TSSOP-8. It can leverage the heat dissipation capability of any PCB and improves die efficiency by approximately 20% compared to TSSOP-8. Single and dual PowerPAK 1212-8 share the same pinout as single and dual PowerPAK SO-8, and the low 1.05 mm profile makes it suitable for space-constrained applications.

Features

AI Translation
  • TrenchFET power MOSFET
  • Low thermal resistance PowerPAK package, compact size with low profile of 1.07 mm
  • 100% Rg and UIS tested

Applications

AI Translation
  • Load Switch