MACOM MA4P506-1072T

MACOM's packaged PIN diode product line covers a wide range of electrical characteristics and package configurations. This diverse combination of semiconductor technology and chip packaging provides considerable flexibility for circuit design. The fast-switching series of packaged PIN diodes utilizes thin I-region, silicon oxide or glass passivated dies, achieving low leakage current and low insertion loss. By using process control monitors to regulate wafer fabrication parameters, these devices deliver consistent performance in control circuit applications. The high-voltage series of packaged PIN diodes employs MACOM's CERMACHIP passivation process, providing a hard glass enclosure with hermetic sealing and protection of the die active region. These packaged CERMACHIP PIN diodes are well suited for high-power applications where high-level RF voltages are present. The diode dies are bonded into hermetically sealed ceramic packages designed for the most demanding electrical and environmental conditions. Multiple package styles are available for use in various RF microwave circuits. This series of packaged PIN diodes is designed with high inherent reliability.

• High power
• Fast speed
• Voltage ratings up to 1500V
• Wide selection of carrier lifetimes
• Wide selection of capacitance values
• Full range of package styles
• RoHS compliant

• High-power RF applications