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Infineon IRF6721STRPBF product image
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Infineon IRF6721STRPBF

Manufacturer
MPN
IRF6721STRPBF
LCSC Part #
C3282832
Packaging
-
Customer #
Key Attributes
MOSFET, Current:14A, Voltage:30V
Datasheetpdf iconInfineon IRF6721STRPBF
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QtyUnit Price(Reference Only)Total Amount
1+$ 0.4861$ 0.49
200+$ 0.1883$ 37.66
500+$ 0.1821$ 91.05
1,000+$ 0.179$ 179.00
Standard Packaging2183/Full Bag
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Products Specifications

All
TypeDescription
CategoryDiscrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs
ManufacturerInfineon
Packaging-
Operating Temperature-40℃~+150℃
Drain to Source Voltage30V
Current - Continuous Drain(Id)60A
Gate Threshold Voltage (Vgs(th))2.4V
Pd - Power Dissipation42W
Reverse Transfer Capacitance (Crss@Vds)140pF
RDS(on)10.9mΩ@4.5V
Number1 N-channel
Input Capacitance(Ciss)1.43nF
Gate Charge(Qg)17nC

Introduction

AI Translation

The IRF6721SPbF combines the latest HEXFET power MOSFET silicon technology with the advanced DirectFET package to achieve the lowest on-resistance in a package with MICRO-8 footprint and only 0.7 mm height. When following the manufacturing method and process instructions in Application Note AN-1035, the DirectFET package is compatible with existing layout geometries, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques used in power applications. The DirectFET package supports dual-side cooling to maximize thermal transfer efficiency in power systems, reducing thermal resistance by 80% compared to the previous best.

The IRF6721SPbF strikes a balance between low resistance and low charge while featuring ultra-low package inductance to reduce conduction and switching losses. The reduction in total losses makes this product ideal for high-efficiency DC-DC converters powering the next generation of processors operating at high frequencies. The IRF6721SPbF is optimized for parameters critical to synchronous buck operation, including Rds(on) and gate charge in 12 V bus converters, to minimize losses.

Features

AI Translation
  • Low profile (< 0.7 mm)
  • Dual-sided heat dissipation
  • Ultra-low package inductance
  • Optimized for high-frequency switching
  • Optimized for control FET applications
  • Low conduction and switching losses
  • Compatible with existing SMT processes
  • 100% Rg tested

Applications

AI Translation
  • CPU Core DC-DC Converter