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RENESAS R5F572NDHDBG#20

Produttore
Cod. Prod.
R5F572NDHDBG#20
Cod. LCSC
C3216577
Imballo
LFBGA-176
Numero Cliente
Attr. chiave
RXv3 32 Bit 240MHz 136 LFBGA-176 Microcontrollers RoHS
Scheda Tecnicapdf iconRENESAS R5F572NDHDBG#20
Parti alternative7
Esaurito
Avvisami
Minimo: 1Multiplo: 1Unità di vendita: Piece
Aggiungi alla Lista BOM
QtàPr. unit.(Solo per riferimento)Importo totale
1+$ 15.8356$ 15.84
200+$ 6.1287$ 1225.74
500+$ 5.9127$ 2956.35
1,000+$ 5.8063$ 5806.30
Package Standard152/Full Tray
Prezzo migliore per quantità maggiore?
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Specifiche del Prodotto

Tutto
TipoDescrizione
CategoriaIntegrated Circuits (ICs)/Embedded/Microcontrollers
ProduttoreRENESAS
ImballoLFBGA-176
DAC (Bit)12bit
ADC (Bit)12bit
Operating Temperature-40℃~+85℃
Program Memory TypeFLASH
Voltage - Supply2.7V~3.6V
Program Storage Size2MB
EEPROM32KB
CPU CoreRXv3
Core Size32 Bit
CPU Maximum Speed240MHz
Oscillator TypeBuilt-in
Number of I/O136

Descrizione

Traduzione AI

240-MHz 32-bit RX MCU, on-chip double-precision FPU, 1396 CoreMark, Arithmetic unit for trigonometric functions, up to 4-MB flash memory (supportive of the dual bank function), 1-MB SRAM, various communications interfaces including Ethernet MAC compliant with IEEE 1588, SD host interface, quad SPI, and CAN, 12-bit A/D converter, RTC, Encryption functions (optional), Serial sound interface, CMOS camera interface, Graphic-LCD controller, 2D drawing engine

Caratteristiche

Traduzione AI
  • 32-bit RXv3 CPU core:
    • Maximum operating frequency: 240 MHz
    • Double-precision 64-bit IEEE-754 floating point
    • A collective register bank save function is available.
    • Supports the memory protection unit (MPL)
    • JTAG and FINE (one-line) debugging interfaces
  • Low-power design and architecture:
    • Operation from a single 2.7- to 3.6-V supply
    • RTC is capable of operation from a dedicated power supply.
    • Four low-power modes
  • On-chip code flash memory:
    • On-chip code flash memory
    • Supports versions with up to 4 Mbytes of ROM
    • No wait cycles at up to 120 MHz or when the ROM cache is hit, one-wait state at above 120 MHz
    • User code is programmable by on-board or off-board programming.
    • Programming/erasing as background operations (BGOs)
    • A dual-bank structure allows exchanging the start-up bank.
  • On-chip data flash memory:
    • On-chip data flash memory
    • 32 Kbytes, reprogrammable up to 100,000 times
    • Programming/erasing as background operations (BGOs)
  • On-chip SRAM:
    • On-chip SRAM
    • 1 Mbyte of SRAM (no wait states; however, if ICLK is at a frequency above 120 MHz access to locations in the 512 Kbytes of SRAM from 0080 00000h to 0087 FFFF requires one cycle of waiting)
    • 32 Kbytes of RAM with ECC (single error correction/double error detection)
    • 8 Kbytes of standby RAM (backup on deep software standby)
  • Data transfer:
    • DMAcAa: 8 channels
    • DTCb: 1 channel
    • EXDMAC: 2 channels
    • DMAC for the Ethernet controller: 3 channels
  • Reset and supply management:
    • Power-on reset (POR)
    • Low voltage detection (LVD) with voltage settings
  • Clock functions:
    • External crystal resonator or internal PLL for operation at 8 to 24 MHz
    • PLL for specific purposes
    • Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20 MHz
    • 120-kHz clock for the IwDTa
  • Real-time clock:
    • Adjustment functions (30 seconds, leap year, and error)
    • Real-time clock counting and binary counting modes are selectable
    • Time capture function (for capturing times in response to event-signal input)
  • Independent watchdog timer:
    • 120-kHz clock operation
  • Useful functions for IEC60730 compliance:
    • Oscillation-stoppage detection, frequency measurement, CRCA, IwDTa, self-diagnostic function for the A/D converter, etc.
    • Register write protection function can protect values in important registers against overwriting.
  • Various communications interfaces:
    • Ethernet MAC compliant with IEEE 1588 (2 channels)
    • PHY layer (1 channel) for host/function or OTG controller (1 channel) with full-speed USB 2.0 transfer
    • CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 channels)
    • SCI and SCII with multiple functionalities (up to 8 channels) Choose from among asynchronous mode, clock-synchronous mode, smart-card interface mode, simplified SPI, simplified I²C and extended serial mode.
    • SCI with 16-byte transmission and reception FIFOs (up to 5 channels)
    • I²C bus interface for transfer at up to 1 Mbps (3 channels)
    • Four wire QPPI (1 channel) in addition to RPPIs (3 channels)
    • Parallel data capture unit (PDC) for the CMOS camera interface (except for 100-pin products)
    • Graphic-LCD controller (GLCDC)
    • 2D drawing engine (DRIW2D)
    • SD host interface (1 channel) with a 1- or 4-bit SD bus for use with SD memory or SDIO
    • MMCIF with 1-, 4-, or 8-bit transfer bus width
  • External address space:
    • Buses for full-speed data transfer (max. operating frequency of 80 MHz)
    • 8 CS areas
    • 8-16- or 32-bit bus space is selectable per area
    • Independent SDRAM area (128 Mbytes)
  • Up to 29 extended-function timers:
    • 32-bit GPTW (4 channels)
    • 16-bit TPUa (6 channels), MTU3a (9 channels)
    • 8-bit TMRa (4 channels), 12-bit CMT (4 channels), 32-bit CMTW (2 channels)
  • 12-bit A/D converter:
    • Two 12-bit units (8 channels for unit 0; 21 channels for unit 1)
    • Self diagnosis, detection of analog input disconnection
  • 12-bit D/A converter: 2 channels
    • Temperature sensor for measuring temperature within the chip
  • Encryption functions (optional):
    • AES (key lengths: 128, 192, and 256 bits)
    • Trusted Secure IP (TSP)
  • Up to 182 pins for general I/O ports:
    • 5-V tolerance, open drain, input pull-up, switchable driving ability
  • Operating temp. range:
    • D-version: -40°C to +85°C
    • G-version: -40°C to +105°C

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