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Qorvo RFFC5072TR13
| Manufacturer | |
| MPN | RFFC5072TR13 |
| LCSC Part # | C3034742 |
| Packaging | QFN-32 |
| Customer # | |
| Key Attributes | RFFC5072 Manufacturing Notes |
| Datasheet |  Qorvo RFFC5072TR13 |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Misc ICs and Modules | |
| Manufacturer | Qorvo | |
| Packaging | QFN-32 | |
| Features | - |
| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Misc ICs and Modules | |
| Manufacturer | Qorvo |
| Type | Description | |
|---|---|---|
| Packaging | QFN-32 | |
| Features | - |
Introduction
A quad flat pack - no leads (QFN) package consists of a lead frame base containing one or more die attached to a ground pad provided in the center of the package. The leads and ground pad are all made from the same Cu material, using an etch process that forms the leads and ground pad in predetermined configurations and sizes. The assembled device is then coated with a protective plastic overmold material, which provides mechanical and environmental protection to the package. The input and output terminations for the RFFC5072 are in the form of Cu leads that are formed around the periphery of the package and are coated with a surface finish (Matte - Sn (tin); 8 – 20μm thickness).
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 14.9706 | $ 14.97 |
| 10+ | $ 14.2783 | $ 142.78 |
| 30+ | $ 13.0782 | $ 392.35 |
| 100+ | $ 12.0302 | $ 1203.02 |
Standard Packaging2500/Full Reel | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Misc ICs and Modules | |
| Manufacturer | Qorvo | |
| Packaging | QFN-32 | |
| Features | - |
| Type | Description | |
|---|---|---|
| Category | RF and Wireless/RF Misc ICs and Modules | |
| Manufacturer | Qorvo |
| Type | Description | |
|---|---|---|
| Packaging | QFN-32 | |
| Features | - |
Introduction
A quad flat pack - no leads (QFN) package consists of a lead frame base containing one or more die attached to a ground pad provided in the center of the package. The leads and ground pad are all made from the same Cu material, using an etch process that forms the leads and ground pad in predetermined configurations and sizes. The assembled device is then coated with a protective plastic overmold material, which provides mechanical and environmental protection to the package. The input and output terminations for the RFFC5072 are in the form of Cu leads that are formed around the periphery of the package and are coated with a surface finish (Matte - Sn (tin); 8 – 20μm thickness).
C3034742 EasyEDA Library
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | 5A991g |
| CNHTS | |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | 5A991g |
| CNHTS | |
| USHTS | |
| TARIC |
| Type | Details |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |