Infineon/CYPRESS CY8C6336BZI-BLF03

PSoC™ 6 MCU is a high-performance, ultra-low-power and secured MCU platform, purpose-built for IoT applications. The PSoC™ 63 with Bluetooth® LE product line, based on the PSoC™ 6 MCU platform, is a combination of a high-performance microcontroller with low-power flash technology, digital programmable logic, high-performance analog-to-digital conversion and standard communication and timing peripherals. The PSoC 63 product line provides wireless connectivity with Bluetooth® LE 5.0 compliance.

• 32-bit Dual CPU subsystem: 150-MHz Arm® Cortex®-M4F (CM4) CPU with single-cycle multiply, floating point, and memory protection unit (MPU); 100-MHz Cortex®-M0+ (CM0+) CPU with single-cycle multiply and MPU; User-selectable core logic operation at either 1.1 V or 0.9 V; Active CPU current slope with 1.1-V core operation (Cortex®-M4: 40 µA/MHz, Cortex®-M0+: 20 µA/MHz); Active CPU current slope with 0.9-V core operation (Cortex®-M4: 22 µA/MHz, Cortex®-M0+: 15 µA/MHz); Two DMA controllers with 16 channels each.
• Memory subsystem: 1-MB application flash, 32-KB auxiliary flash (AUXflash), and 32-KB supervisory flash (SFlash); read-while-write (RWW) support. Two 8-KB flash caches, one for each CPU. 288-KB SRAM with power and data retention control.
• One-time-programmable (OTP) 1-Kb eFuse array.
• Bluetooth® Low Energy subsystem: 2.4-GHz RF transceiver with 50-Ω antenna drive; Digital PHY; Link Layer engine supporting master and slave modes; Programmable TX power: up to 4 dBm; RX sensitivity: –95 dBm; RSSI: 4-dB resolution; 5.7-mA Tx (0 dBm) and 6.7 mA RX (2 Mbps) current with 3.3-V supply and internal SIMO Buck converter; Link Layer engine supports four connections simultaneously; Supports 2 Mbps data rate.
• Low-power 1.7-V to 3.6-V operation: Six power modes for fine-grained power management; Deep Sleep mode current of 7 µA with 64-KB SRAM retention; On-chip Single-In Multiple Out (SIMO) DC-DC buck converter, <1 µA quiescent current; Backup domain with 64 bytes of memory and real-time clock.
• Flexible clocking options: 8-MHz Internal Main Oscillator (IMO) with ±2% accuracy; Ultra-low-power 32-kHz Internal Low-speed Oscillator (ILO); On-chip crystal oscillators (16 to 35 MHz, and 32 kHz); Phase-locked loop (PLL) for multiplying clock frequencies; Frequency-locked loop (FLL) for multiplying IMO frequency; Integer and fractional peripheral clock dividers.
• Quad SPI (QSPI)/Serial Memory Interface (SMIF): Execute-In-Place (XIP) from external quad SPI Flash; On-the-fly encryption and decryption; 4-KB cache for greater XIP performance with lower power; Supports single, dual, quad, dual-quad, and octal interfaces with throughput up to 640 Mbps.
• Segment LCD Drive: Supports up to 83 segments and up to 8 commons.
• Serial communication: Nine run-time configurable serial communication blocks (SCBs); Eight SCBs: configurable as SPI, I²C, or UART; One Deep Sleep SCB: configurable as SPI or I²C; USB full-speed device interface.
• Audio subsystem: Two pulse density modulation (PDM) channels and one I²S channel with time division multiplexed (TDM) mode.
• Timing and pulse-width modulation: Thirty-two timer/counter/pulse-width modulators (TCPWM); Center-aligned, edge, and pseudo-random modes; Comparator-based triggering of Kill signals.
• Programmable analog: 12-bit 1-Msps SAR ADC with differential and single-ended modes and 16-channel sequencer with result averaging; Two low-power comparators available in Deep Sleep and Hibernate modes; Built-in temperature sensor connected to ADC; One 12-bit voltage-mode digital-to-analog converter (DAC) with <2-µs settling time; Two opamps with low-power operation modes.
• Up to 84 programmable GPIOs: Two Smart I/O™ ports (16 I/Os) enable Boolean operations on GPIO pins; available during system Deep Sleep; Programmable drive modes, strengths, and slew rates; Six overvoltage-tolerant (OVT) pins.
• Capacitive sensing: CAPSENSE™ provides best-in-class signal-to-noise ratio (SNR), liquid tolerance, and proximity sensing; Enables dynamic usage of both self and mutual sensing; Automatic hardware tuning (SmartSense).
• Security Built into Platform Architecture: ROM-based root of trust via uninterruptible “Secure Boot”; Step-wise authentication of execution images; Secured execution of code in execute-only mode for protected routines; All Debug and Test ingress paths can be disabled; Up to eight Protection Contexts.
• Cryptography accelerator: Hardware acceleration for symmetric and asymmetric cryptographic methods and hash functions; True random number generation (TRNG) function.
• Programmable digital: Twelve programmable logic blocks, each with 8 Macrocells and an 8-bit data path (called universal digital blocks or UDBs); Usable as drag-and-drop Boolean primitives (gates, registers), or as Verilog-programmable blocks; Infineon-provided peripheral component library using UDBs to implement functions such as communication peripherals, Waveform Generators, Pseudo-Random Sequence (PRS) generation, and many other functions.
• Profiler: Eight counters provide event or duration monitoring of on-chip resources.
• Packages: 124-BGA and 104-M-CSP; with USB; 116-BGA, 104-M-CSP, and 68-QFN; no USB.

• IoT applications