VISHAY THJP0603AST1
| Manufacturer | |
| MPN | THJP0603AST1 |
| LCSC Part # | C22414744 |
| Packaging | - |
| Customer # | |
| Key Attributes | ThermaWick Thermal Jumper Surface Mount Chip |
| Datasheet |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Fans, Blowers, Thermal Management/Thermal/Pads, Sheets, Bridges | |
| Manufacturer | VISHAY | |
| Packaging | - | |
| Features | - |
| Type | Description | |
|---|---|---|
| Category | Fans, Blowers, Thermal Management/Thermal/Pads, Sheets, Bridges | |
| Manufacturer | VISHAY |
| Type | Description | |
|---|---|---|
| Packaging | - | |
| Features | - |
Introduction
THJP surface mount chips are designed to provide an electrically isolated thermally conductive path to a ground plane or heat sink while maintaining electrical isolation of the device. Built on an aluminum nitride substrate, the device is available in both tin-lead and lead-free full wraparound termination styles. The low capacitance characteristic makes it an ideal choice for high-frequency and thermal gradient applications. Custom sizes are available.
Features
- Electrically isolated thermal conductor
- High thermal conductivity aluminum nitride substrate
- Electrically insulating terminals
- Low capacitance
- Available with tin-lead or lead-free fully encapsulated terminals
- AEC-Q200 compliant
Applications
- Power Supplies and Converters
- RF Amplifiers
- Synthesizers
- Switch-Mode Power Supplies
- PIN and Laser Diodes
- Filters
| Qty | Unit Price | Total Amount |
|---|---|---|
| 1+ | $ 1.3435 | $ 1.34 |
| 10+ | $ 1.1044 | $ 11.04 |
| 30+ | $ 0.9726 | $ 29.18 |
| 100+ | $ 0.8246 | $ 82.46 |
| 500+ | $ 0.7596 | $ 379.80 |
| 1,000+ | $ 0.7303 | $ 730.30 |
Standard Packaging1000/Full Reel | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Fans, Blowers, Thermal Management/Thermal/Pads, Sheets, Bridges | |
| Manufacturer | VISHAY | |
| Packaging | - | |
| Features | - |
| Type | Description | |
|---|---|---|
| Category | Fans, Blowers, Thermal Management/Thermal/Pads, Sheets, Bridges | |
| Manufacturer | VISHAY |
| Type | Description | |
|---|---|---|
| Packaging | - | |
| Features | - |
Introduction
THJP surface mount chips are designed to provide an electrically isolated thermally conductive path to a ground plane or heat sink while maintaining electrical isolation of the device. Built on an aluminum nitride substrate, the device is available in both tin-lead and lead-free full wraparound termination styles. The low capacitance characteristic makes it an ideal choice for high-frequency and thermal gradient applications. Custom sizes are available.
Features
- Electrically isolated thermal conductor
- High thermal conductivity aluminum nitride substrate
- Electrically insulating terminals
- Low capacitance
- Available with tin-lead or lead-free fully encapsulated terminals
- AEC-Q200 compliant
Applications
- Power Supplies and Converters
- RF Amplifiers
- Synthesizers
- Switch-Mode Power Supplies
- PIN and Laser Diodes
- Filters
C22414744 EasyEDA Library
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | |
| USHTS | |
| TARIC |
| Type | Details |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |



