Everspin Tech EMD4E001G16G2-150CAS2R

Products Specifications

All

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	Everspin Tech
Packaging	BGA-96(10x13)
Operating Temperature	-
Features	On-chip DLL clock alignment function
Memory Size	1Gbit
Voltage - Supply	-
Memory Format	MRAM
Interface	-

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	Everspin Tech
Packaging	BGA-96(10x13)
Operating Temperature	-
Features	On-chip DLL clock alignment function

AI Translation

128Mb x8, 64Mb x16 Organization
Supports most DDR4 features
Page size of 1024 bits for x8, 2048 bits for x16
VDD = VDDQ = 1.2v
VPP = 2.5V
Operating Temperature of 0℃ to 85℃
667MHz clock frequency (fCK)
On-Device Termination
Multipurpose register READ and WRITE capability
Per-Device addressability (PDA)
Connectivity Test
On-Chip DLL aligns DQ, DQS, DQS transition with CK transition
Burst lengths of 8 addresses
All addresses and control inputs are latched on rising edge of the clock
Bit Error Rate (BER) = 1x10⁻¹¹
Data Retention = 3 months at 70℃
Cycle Endurance = 1x10¹⁰
Standard FBGA package options (Pb-free):
- 78-ball (10mmx13mm) package (x8)
- 96-ball (10mmx13mm) package (x16)
Timing – cycle time:
- 1.5ns @ CL = 10 (ST-DDR4 1333)
- 1.5ns @ CWL = 9 (ST-DDR4 1333)

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Qty	Unit Price(Reference Only)	Total Amount
1+	$ 266.0161	$ 266.02
200+	$ 106.1422	$ 21228.44
500+	$ 102.5957	$ 51297.85
1,000+	$ 100.843	$ 100843.00
Standard Packaging2000/Full Reel

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All

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	Everspin Tech
Packaging	BGA-96(10x13)
Operating Temperature	-
Features	On-chip DLL clock alignment function
Memory Size	1Gbit
Voltage - Supply	-
Memory Format	MRAM
Interface	-

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	Everspin Tech
Packaging	BGA-96(10x13)
Operating Temperature	-
Features	On-chip DLL clock alignment function

AI Translation

128Mb x8, 64Mb x16 Organization
Supports most DDR4 features
Page size of 1024 bits for x8, 2048 bits for x16
VDD = VDDQ = 1.2v
VPP = 2.5V
Operating Temperature of 0℃ to 85℃
667MHz clock frequency (fCK)
On-Device Termination
Multipurpose register READ and WRITE capability
Per-Device addressability (PDA)
Connectivity Test
On-Chip DLL aligns DQ, DQS, DQS transition with CK transition
Burst lengths of 8 addresses
All addresses and control inputs are latched on rising edge of the clock
Bit Error Rate (BER) = 1x10⁻¹¹
Data Retention = 3 months at 70℃
Cycle Endurance = 1x10¹⁰
Standard FBGA package options (Pb-free):
- 78-ball (10mmx13mm) package (x8)
- 96-ball (10mmx13mm) package (x16)
Timing – cycle time:
- 1.5ns @ CL = 10 (ST-DDR4 1333)
- 1.5ns @ CWL = 9 (ST-DDR4 1333)