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Everspin Tech EM004LXOBB320IS1T product image
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Everspin Tech EM004LXOBB320IS1TRoHS

Manufacturer
Everspin Tech
MPN
EM004LXOBB320IS1T
LCSC Part #
C20342491
Packaging
TBGA-24(6x8)
Customer #
Key Attributes
TBGA-24(6x8) Memory RoHS
Datasheetpdf iconEverspin Tech EM004LXOBB320IS1T
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QtyUnit Price(Reference Only)Total Amount
1+$ 15.8123$ 15.81
200+$ 6.3094$ 1261.88
480+$ 6.0983$ 2927.18
960+$ 5.9951$ 5755.30
Standard Packaging480/Full Tray
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerEverspin Tech
PackagingTBGA-24(6x8)
FeaturesDedicated OTP region function;Write protection function;Hardware write protection function;Software write protection function;Block protection function;Write enable latch function;Interrupt status indication function
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Features

AI Translation
  • Extended SPI bus interface support
  • Octal, quad, dual, and single SPI protocol support
  • Octal SPI STR/DTR up to 200MHz
  • SPI, DSPI, QSPI up to 133MHz
  • Data endurance: unlimited read/write and erase operations over product lifetime
  • Data retention: minimum 10 years across temperature ranges
  • JEDEC compliance: JESD251, JESD251-1
  • Persistent memory with byte-level read/write — no erase required
  • Data integrity: no external ECC required
  • Low-power modes:
    • Standby current < 350μA
    • Deep power-down current 50μA
  • SPI compatibility: compatible with NVSRAM, FRAM, NOR, Toggle MRAM
  • SPI, xSPI commands for NOR-compatible execute-in-place (XIP) emulation
  • Volatile and non-volatile configuration setting support
  • Non-volatile settings without reflow protection
  • Dedicated 256-byte OTP region outside main memory
    • Readable and user-lockable
    • Permanently lockable via WRITE OTP command
    • No reflow protection
  • Erase capabilities:
    • Chip/bulk erase and sector erase
    • Sub-sector erase granularity: 4KB, 32KB
  • Voltage: 1.65–2.0V (1.8V)
  • Density: EM004LXB 4Mb, EM008LXB 8Mb, EM016LXB 16Mb
  • Sustained throughput up to 400MBps for OSPI read/write at 200MHz DTR
  • Boot mode configuration:
    • x1, x2, x4, x8 boot support
  • Software reset and hardware reset pin
  • 3-byte and 4-byte address mode support
  • Sequential (burst) read/write support
  • Electronic signature:
    • JEDEC standard 3-byte signature
  • JEDEC standard, RoHS-compliant packages:
    • 24-ball BGA, 6mm×8mm (5×5 array)
    • 8-pin DFN, 5mm×6mm
  • Operating temperature range:
    • Commercial: 0°C ~ +70°C
    • Industrial: -40°C ~ +85°C
  • Security and write protection:
    • 16 configurable hardware write-protect regions plus top/bottom selection
    • Program/erase protection during power-up; unintended user data modification detection via CRC command