Infineon IRF7104TRPBF
| Manufacturer | |
| MPN | IRF7104TRPBF |
| LCSC Part # | C169767 |
| Packaging | SO-8 |
| Customer # | |
| Key Attributes | MOSFET P-CH ARR 20V 2.3A SO-8 |
| Datasheet |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/FET, MOSFET Arrays | |
| Manufacturer | Infineon | |
| Packaging | SO-8 | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 2.3A | |
| Pd - Power Dissipation | 2W | |
| RDS(on) | 400mΩ@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 3V | |
| Type | P-Channel | |
| Reverse Transfer Capacitance (Crss@Vds) | 67pF | |
| Number | 2 P-Channel | |
| Input Capacitance(Ciss) | 290pF | |
| Gate Charge(Qg) | 25nC@10V | |
| Operating Temperature | - | |
| Output Capacitance(Coss) | 210pF |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/FET, MOSFET Arrays | |
| Manufacturer | Infineon | |
| Packaging | SO-8 | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 2.3A | |
| Pd - Power Dissipation | 2W | |
| RDS(on) | 400mΩ@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 3V |
| Type | Description | |
|---|---|---|
| Type | P-Channel | |
| Reverse Transfer Capacitance (Crss@Vds) | 67pF | |
| Number | 2 P-Channel | |
| Input Capacitance(Ciss) | 290pF | |
| Gate Charge(Qg) | 25nC@10V | |
| Operating Temperature | - | |
| Output Capacitance(Coss) | 210pF |
Introduction
Fourth Generation HEXFETs utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and dual-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
Features
- Adavanced Process Technology
- Ultra Low On-Resistance
- Dual P-Channel MOSFET
- Surface Mount
- Available in Tape & Reel
- Dynamic dv/dt Rating
- Fast Switching
- Lead-Free
| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 0.7204 | $ 0.72 |
| 10+ | $ 0.5874 | $ 5.87 |
| 30+ | $ 0.5209 | $ 15.63 |
| 100+ | $ 0.4544 | $ 45.44 |
| 500+ | $ 0.4148 | $ 207.40 |
| 1,000+ | $ 0.3942 | $ 394.20 |
Standard Packaging4000/Full Reel | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/FET, MOSFET Arrays | |
| Manufacturer | Infineon | |
| Packaging | SO-8 | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 2.3A | |
| Pd - Power Dissipation | 2W | |
| RDS(on) | 400mΩ@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 3V | |
| Type | P-Channel | |
| Reverse Transfer Capacitance (Crss@Vds) | 67pF | |
| Number | 2 P-Channel | |
| Input Capacitance(Ciss) | 290pF | |
| Gate Charge(Qg) | 25nC@10V | |
| Operating Temperature | - | |
| Output Capacitance(Coss) | 210pF |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/FET, MOSFET Arrays | |
| Manufacturer | Infineon | |
| Packaging | SO-8 | |
| Drain to Source Voltage | 20V | |
| Current - Continuous Drain(Id) | 2.3A | |
| Pd - Power Dissipation | 2W | |
| RDS(on) | 400mΩ@4.5V | |
| Gate Threshold Voltage (Vgs(th)) | 3V |
| Type | Description | |
|---|---|---|
| Type | P-Channel | |
| Reverse Transfer Capacitance (Crss@Vds) | 67pF | |
| Number | 2 P-Channel | |
| Input Capacitance(Ciss) | 290pF | |
| Gate Charge(Qg) | 25nC@10V | |
| Operating Temperature | - | |
| Output Capacitance(Coss) | 210pF |
Introduction
Fourth Generation HEXFETs utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and dual-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
Features
- Adavanced Process Technology
- Ultra Low On-Resistance
- Dual P-Channel MOSFET
- Surface Mount
- Available in Tape & Reel
- Dynamic dv/dt Rating
- Fast Switching
- Lead-Free
C169767 EasyEDA Library
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |
| Type | Details |
|---|---|
| RoHS | |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| Type | Details |
|---|---|
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |



