Lattice LFE2M70E-6FN900I
| Manufacturer | |
| MPN | LFE2M70E-6FN900I |
| LCSC Part # | C1552812 |
| Packaging | FPBGA-900 |
| Customer # | |
| Key Attributes | 67000 8375 FPBGA-900 FPGAs (Field Programmable Gate Array) RoHS |
| Datasheet |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Lattice | |
| Packaging | FPBGA-900 | |
| Embedded Block RAM | 4642816bit | |
| Voltage - Supply(VCCIO) | - | |
| Number of Logic Elements/Blocks | 67000 | |
| Logic Array Blocks | 8375 | |
| Operating Temperature | -40℃~+100℃ | |
| Type | - |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Lattice | |
| Packaging | FPBGA-900 | |
| Embedded Block RAM | 4642816bit | |
| Voltage - Supply(VCCIO) | - |
| Type | Description | |
|---|---|---|
| Number of Logic Elements/Blocks | 67000 | |
| Logic Array Blocks | 8375 | |
| Operating Temperature | -40℃~+100℃ | |
| Type | - |
Introduction
The LatticeECP2/M series FPGA devices are optimized to deliver advanced DSP blocks, high-speed SERDES (LatticeECP2M series only), and high-speed source-synchronous interfaces in a cost-effective FPGA architecture. This combination is achieved through advances in device architecture and the use of 90nm technology. The LatticeECP2/M FPGA architecture is optimized for high performance and low cost, incorporating LUT-based logic, distributed and embedded memory, PLLs, DLLs, pre-engineered source-synchronous I/O support, enhanced sysDSP blocks, and advanced configuration support including encryption ("S" versions only) and dual-boot capability. The LatticeECP2M device family features high-speed SERDES with PCS. These SERDES with PCS blocks, offering high jitter tolerance and low transmit jitter, can be configured to support a range of popular data protocols including PCI Express, Ethernet (1GbE and SGMII), OBSAI, and CPRI. Transmit pre-emphasis and receive equalization settings make the SERDES suitable for chip-to-chip and small-form-factor backplane applications. Lattice Diamond® design software enables efficient implementation of large, complex designs using the LatticeECP2/M FPGA family. The LatticeECP2/M synthesis library support is compatible with popular logic synthesis tools. The software uses synthesis tool output and constraints from its floorplanning tool to place and route designs in LatticeECP2/M devices. The design tool extracts timing from the routed design and back-annotates it into the design for timing verification. Lattice provides numerous pre-designed IP blocks for the LatticeECP2/M family. By using these IP cores as standardized building blocks, designers can focus on the unique aspects of their designs, thereby improving productivity.
Features
- High logic density for system integration
- 6K to 95K LUTs
- 90 to 583 I/Os
- Embedded SERDES (LatticeECP2M only)
- Data rates 250 Mbps to 3.125 Gbps
- Up to 16 channels per device, supporting PCI Express, Ethernet (1GbE, SGMII), OBSAI, CPRI, and Serial RapidIO
- sysDSP™ blocks
- 3 to 42 blocks for high-performance multiply and accumulate
- Each block supports one 36×36, four 18×18, or eight 9×9 multipliers
- Flexible memory resources
- 55Kbits to 5308Kbits sysMEM™ embedded block RAM
- 18Kbit blocks
- Single-port, pseudo dual-port, and true dual-port
- Byte enable mode support
- 12K to 202Kbits distributed RAM
- Single-port and pseudo dual-port
- sysCLOCK analog PLLs and DLLs
- Two GPLLs and up to six SPLLs per device
- Clock multiplication, division, phase, and delay adjustment
- Dynamic PLL adjustment
- Two general-purpose DLLs per device
- Pre-designed source-synchronous I/O
- DDR registers in I/O cells
- Dedicated gear logic
- Support for source-synchronous standards such as SPI4.2, SFI4 (DDR mode), XGMII
- High-speed ADC/DAC devices
- Dedicated DDR and DDR2 memory support, DDR1: 400 (200MHz) / DDR2: 533 (266MHz)
- Dedicated DQS support
- Programmable sysI/O™ buffers supporting a wide range of interfaces
- LVTTL and LVCMOS 33/25/18/15/12
- SSTL 3/2/18 I, II
- HSTL15 I and HSTL18 I, II
- PCI and differential HSTL, SSTL
- LVDS, RSDS, Bus-LVDS, MLVDS, LVPECL
- Flexible device configuration
- IEEE 1149.1 boundary scan compliant
- Dedicated bank for configuration I/Os
- SPI boot flash interface
- Dual boot image support
- TransFR™ I/O for simple field updates
- Embedded soft error detection macro
- Optional bitstream encryption (LatticeECP2/M "S" versions only)
- System-level support
- ispTRACY™ internal logic analyzer feature
- On-chip oscillator for initialization and general purpose
- 1.2V core supply
| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 386.3325 | $ 386.33 |
| 200+ | $ 149.5062 | $ 29901.24 |
| 500+ | $ 144.2525 | $ 72126.25 |
| 1,000+ | $ 141.6558 | $ 141655.80 |
Standard Packaging27/Full Tray | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Lattice | |
| Packaging | FPBGA-900 | |
| Embedded Block RAM | 4642816bit | |
| Voltage - Supply(VCCIO) | - | |
| Number of Logic Elements/Blocks | 67000 | |
| Logic Array Blocks | 8375 | |
| Operating Temperature | -40℃~+100℃ | |
| Type | - |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Embedded/FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Lattice | |
| Packaging | FPBGA-900 | |
| Embedded Block RAM | 4642816bit | |
| Voltage - Supply(VCCIO) | - |
| Type | Description | |
|---|---|---|
| Number of Logic Elements/Blocks | 67000 | |
| Logic Array Blocks | 8375 | |
| Operating Temperature | -40℃~+100℃ | |
| Type | - |
Introduction
The LatticeECP2/M series FPGA devices are optimized to deliver advanced DSP blocks, high-speed SERDES (LatticeECP2M series only), and high-speed source-synchronous interfaces in a cost-effective FPGA architecture. This combination is achieved through advances in device architecture and the use of 90nm technology. The LatticeECP2/M FPGA architecture is optimized for high performance and low cost, incorporating LUT-based logic, distributed and embedded memory, PLLs, DLLs, pre-engineered source-synchronous I/O support, enhanced sysDSP blocks, and advanced configuration support including encryption ("S" versions only) and dual-boot capability. The LatticeECP2M device family features high-speed SERDES with PCS. These SERDES with PCS blocks, offering high jitter tolerance and low transmit jitter, can be configured to support a range of popular data protocols including PCI Express, Ethernet (1GbE and SGMII), OBSAI, and CPRI. Transmit pre-emphasis and receive equalization settings make the SERDES suitable for chip-to-chip and small-form-factor backplane applications. Lattice Diamond® design software enables efficient implementation of large, complex designs using the LatticeECP2/M FPGA family. The LatticeECP2/M synthesis library support is compatible with popular logic synthesis tools. The software uses synthesis tool output and constraints from its floorplanning tool to place and route designs in LatticeECP2/M devices. The design tool extracts timing from the routed design and back-annotates it into the design for timing verification. Lattice provides numerous pre-designed IP blocks for the LatticeECP2/M family. By using these IP cores as standardized building blocks, designers can focus on the unique aspects of their designs, thereby improving productivity.
Features
- High logic density for system integration
- 6K to 95K LUTs
- 90 to 583 I/Os
- Embedded SERDES (LatticeECP2M only)
- Data rates 250 Mbps to 3.125 Gbps
- Up to 16 channels per device, supporting PCI Express, Ethernet (1GbE, SGMII), OBSAI, CPRI, and Serial RapidIO
- sysDSP™ blocks
- 3 to 42 blocks for high-performance multiply and accumulate
- Each block supports one 36×36, four 18×18, or eight 9×9 multipliers
- Flexible memory resources
- 55Kbits to 5308Kbits sysMEM™ embedded block RAM
- 18Kbit blocks
- Single-port, pseudo dual-port, and true dual-port
- Byte enable mode support
- 12K to 202Kbits distributed RAM
- Single-port and pseudo dual-port
- sysCLOCK analog PLLs and DLLs
- Two GPLLs and up to six SPLLs per device
- Clock multiplication, division, phase, and delay adjustment
- Dynamic PLL adjustment
- Two general-purpose DLLs per device
- Pre-designed source-synchronous I/O
- DDR registers in I/O cells
- Dedicated gear logic
- Support for source-synchronous standards such as SPI4.2, SFI4 (DDR mode), XGMII
- High-speed ADC/DAC devices
- Dedicated DDR and DDR2 memory support, DDR1: 400 (200MHz) / DDR2: 533 (266MHz)
- Dedicated DQS support
- Programmable sysI/O™ buffers supporting a wide range of interfaces
- LVTTL and LVCMOS 33/25/18/15/12
- SSTL 3/2/18 I, II
- HSTL15 I and HSTL18 I, II
- PCI and differential HSTL, SSTL
- LVDS, RSDS, Bus-LVDS, MLVDS, LVPECL
- Flexible device configuration
- IEEE 1149.1 boundary scan compliant
- Dedicated bank for configuration I/Os
- SPI boot flash interface
- Dual boot image support
- TransFR™ I/O for simple field updates
- Embedded soft error detection macro
- Optional bitstream encryption (LatticeECP2/M "S" versions only)
- System-level support
- ispTRACY™ internal logic analyzer feature
- On-chip oscillator for initialization and general purpose
- 1.2V core supply
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991D |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC | |
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS |
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991D |
| CNHTS | 8542319090 |
| USHTS | |
| TARIC |
| Type | Details |
|---|---|
| CAHTS | |
| BRHTS | |
| INHTS | |
| MXHTS | |

