AMD/XILINX XC7K325T-1FBG676C

Xilin7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost- sensitive, high- volume applications to ultra high- end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high- performance applications. The 7 series FPGAs include: Spartan- 7 Family: Optimized for low cost, lowest power, and high I/O performance. Available in low- cost, very small form- factor packaging for smallest PCB footprint. Artix- 7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high- throughput, cost- sensitive applications. Kintex- 7 Family: Optimized for best price- performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs. Virtex- 7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology. Built on a state- of- the- art, high- performance, low- power (HPL), 28 nm, high- x metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

• Advanced high- performance FPGA logic based on real 6- input lookup table (LUT) technology configurable as distributed memory.
• 36 Kb dual- port block RAM with built- in FIFO logic for on- chip data buffering.
• High- performance SelectO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
• High- speed serial connectivity with built- in multi- gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low- power mode, optimized for chip- to- chip interfaces.
• A user configurable analog- to- digital interface (XADC), incorporating dual 12- bit 1MSPS analog- to- digital converters with on- chip thermal and supply sensors.
• DSP slices with 25 × 18 multiplier, 48- bit accumulator, and pre- adder for high- performance filtering, including optimized symmetric coefficient filtering.
• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
• Low- cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.