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ISSI IS43DR16128C-25DBL product image
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ISSI IS43DR16128C-25DBLRoHS

Manufacturer
ISSIAsian Brands
MPN
IS43DR16128C-25DBL
LCSC Part #
C1348968
Packaging
TWBGA-84(8x12.5)
Customer #
Key Attributes
2Gbit 1.7V~1.9V 400MHz DDR2 SDRAM TWBGA-84(8x12.5) Memory RoHS
Datasheetpdf iconISSI IS43DR16128C-25DBL
Alternative Parts10
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QtyUnit Price(Reference Only)Total Amount
1+$ 7.2555$ 7.26
200+$ 2.8092$ 561.84
500+$ 2.7097$ 1354.85
1,000+$ 2.6608$ 2660.80
Standard Packaging209/Full Tray
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerISSI
PackagingTWBGA-84(8x12.5)
Operating Temperature0℃~+85℃
FeaturesBuilt-in phase-locked loop;Auto precharge function;Data mask function;Dynamic on-chip termination
Refresh Current18mA
Memory Size2Gbit
Voltage - Supply1.7V~1.9V
Clock Frequency400MHz
Memory FormatDDR2 SDRAM
Current - Supply87mA

Introduction

AI Translation

ISSI's 2Gb DDR2 SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the 1/O balls. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the active command are used to select the bank and row to be accessed (BA0 - BA2 select the bank; A0 - A13(x16) or A0 - A14(x8) select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location A0 - A9 for the burst access and to determine if the auto precharge A10 command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized.

Features

AI Translation
  • VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V
  • JEDEC standard 1.8V I/O (SSTL_18-compatible)
  • Double data rate interface: two data transfers per clock cycle
  • Differential data strobe (DQS, DQS)
  • 4-bit prefetch architecture
  • On chip DLL to align DQ and DQS transitions with CK
  • 8 internal banks for concurrent operation
  • Programmable CAS latency (CL) 3, 4, 5, 6, and 7 supported
  • Posted CAS and programmable additive latency (AL) 0, 1, 2, 3, 4, 5, and 6 supported
  • WRITE latency = READ latency - 1 tCK
  • Programmable burst lengths: 4 or 8
  • Adjustable data-output drive strength, full and reduced strength options
  • On-die termination (ODT)

Alternative Parts

MPNManufacturerPackagingAvailabilityUnit Price
IS43DR16128C-25DBL-TRISSITWBGA-84(8x12.5)0$ 16.8599
IS43DR16128C-25DBLI-TRISSITWBGA-84(8x12.5)0$ 18.8411
IS43DR16128C-25DBLIISSITWBGA-84(8x12.5)0$ 20.087
IS43DR16128C-3DBLISSITWBGA-84(8x12.5)0$ 10.8038
IS43DR16128C-3DBL-TRISSITWBGA-84(8x12.5)0$ 7.9384
IS43DR16128C-3DBLIISSITWBGA-84(8x12.5)0$ 14.6188
IS46DR16128C-3DBLA1ISSITWBGA-84(8x12.5)0$ 15.3082
IS46DR16128C-3DBLA2-TRISSITWBGA-84(8x12.5)0$ 37.2413
IS46DR16128C-3DBLA1-TRISSITWBGA-84(8x12.5)0$ 14.6899
IS43DR16128C-3DBLI-TRISSITWBGA-84(8x12.5)0$ 13.3748