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NXP SPC5674KF0VMS2 product image
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NXP SPC5674KF0VMS2

Manufacturer
MPN
SPC5674KF0VMS2
LCSC Part #
C1345276
Packaging
MAPBGA-473
Customer #
Key Attributes
Freescale Series 32 Bit 180MHz MAPBGA-473 Microcontrollers RoHS
Datasheetpdf iconNXP SPC5674KF0VMS2
RoHS Compliance2 documents available
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1+$ 49.8446$ 49.84
200+$ 19.2894$ 3857.88
420+$ 18.6115$ 7816.83
840+$ 18.2771$ 15352.76
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerNXP
PackagingMAPBGA-473
ADC (Bit)12bit
Operating Temperature-40℃~+105℃
Voltage - Supply1.14V~5.5V
Program Memory TypeFLASH
EEPROM64KB
Program Storage Size1.5MB
CPU CoreFreescale Series
Core Size32 Bit
CPU Maximum Speed180MHz
Oscillator TypeBuilt-in

Introduction

AI Translation

The MPC5675K microcontroller, a SafeAssure solution, is a 32-bit embedded controller designed for advanced driver assistance systems with RADAR, CMOS imaging, LIDAR and ultrasonic sensors, and multiple 3-phase motor control applications as in hybrid electric vehicles (HEV) in automotive and high temperature industrial applications. A member of NXP Semiconductor’s MPC5500/5600 family, it contains the Book E compliant Power Architecture technology core with Variable Length Encoding (VLE). This core complies with the Power Architecture embedded category, and is 100 percent user mode compatible with the original Power PC user instruction set architecture (UISA). It offers system performance up to four times that of its MPC5561 predecessor, while bringing you the reliability and familiarity of the proven Power Architecture technology. A comprehensive suite of hardware and software development tools is available to help simplify and speed system design. Development support is available from leading tools vendors providing compilers, debuggers and simulation development environments.

Features

AI Translation
  • High-performance e200z7d dual core
  • 32-bit Power Architecture technology CPU
  • Up to 180 MHz core frequency
  • Dual-issue core
  • Variable length encoding (VLE)
  • Memory management unit (MMU) with 64 entries
  • 16 KB instruction cache and 16 KB data cache
  • Memory available: Up to 2 MB code flash memory with ECC, 64 KB data flash memory with ECC, Up to 512 KB on-chip SRAM with ECC
  • SIL3/ASILD innovative safety concept: LockStep mode and fail-safe protection
  • Sphere of replication (SoR) for key components
  • Redundancy checking units on outputs of the SoR connected to FCCU
  • Fault collection and control unit (FCCU)
  • Boot-time built-in self-test for memory (MBIST) and logic (LBIST) triggered by hardware
  • Boot-time built-in self-test for ADC and flash memory
  • Replicated safety-enhanced watchdog timer
  • Silicon substrate (die) temperature sensor
  • Non-maskable interrupt (NMI)
  • 16-region memory protection unit (MPU)
  • Clock monitoring units (CMU)
  • Power management unit (PMU)
  • Cyclic redundancy check (CRC) units
  • Decoupled Parallel mode for high-performance use of replicated cores
  • Nexus Class 3+ interface
  • Interrupts: Replicated 16-priority interrupt controller
  • GPIOs individually programmable as input, output, or special function
  • 3 general-purpose eTimer units (6 channels each)
  • 3 FlexPWM units with four 16-bit channels per module
  • Communications interfaces:
    • 4 LINFlex modules
    • 3 DSPI modules with automatic chip select generation
    • 4 FlexCAN interfaces (2.0B Active) with 32 message objects
    • FlexRay module (V2.1) with dual channel, up to 128 message objects and up to 10 Mbit/s
    • Fast Ethernet Controller (FEC)
    • 3 I²C modules
  • Four 12-bit analog-to-digital converters (ADCs)
  • 22 input channels
  • Programmable cross triggering unit (CTU) to synchronize ADC conversion with timer and PWM
  • External bus interface
  • Parallel digital interface (PDI)
  • On-chip CAN/UART bootstrap loader
  • Capable of operating on a single 3.3 V voltage supply, 3.3 V-only mode

Applications

AI Translation
  • Advanced driver assistance systems including radar, CMOS imaging, LiDAR, and ultrasonic sensors
  • Multiphase motor control applications such as those in hybrid electric vehicles (HEV)
  • High-temperature industrial applications