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MXIC MX29GL512FHXFI-10QTR product image
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MXIC MX29GL512FHXFI-10QTRRoHS

Manufacturer
MPN
MX29GL512FHXFI-10QTR
LCSC Part #
C2803131
Packaging
LFBGA-64(13x11)
Customer #
Key Attributes
512Mbit 2.7V~3.6V Parallel LFBGA-64(13x11) Memory RoHS
Datasheetpdf iconMXIC MX29GL512FHXFI-10QTR
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QtyUnit Price(Reference Only)Total Amount
1+$ 20.1513$ 20.15
200+$ 7.7982$ 1559.64
500+$ 7.5251$ 3762.55
1,500+$ 7.3893$ 11083.95
Standard Packaging1500/Full Reel
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerMXIC
PackagingLFBGA-64(13x11)
Operating Temperature-40℃~+85℃
FeaturesPower-on reset;Hardware write protection;Software write protection;Absolute write protection
Memory Size512Mbit
Voltage - Supply2.7V~3.6V
Program / Erase Cycles100,000 cycles
Clock Frequency-
Data Retention - TDR (Year)20 Years
Block Erase Time(tBE)-
Write Cycle Time(tWC)-
Page Programming Time (Tpp)10us
Standby Supply Current40uA
InterfaceParallel

Features

AI Translation
  • Read, erase, and program operating voltage range: 2.7 to 3.6V
  • Switchable byte/word mode
  • Memory capacity: 67,108,864 x 8-bit / 33,554,432 x 16-bit
  • 64KW/128KB uniform sector architecture
  • 512 equal-sized sectors
  • 16-byte/8-word page read buffer
  • 64-byte/32-word write buffer
  • Additional 128-word secured silicon sector
  • Factory lock and identification support, with customer-lockable capability
  • Advanced sector protection (software protection and password protection)
  • JEDEC standard compliant
  • Pin and software compatible with single-supply flash memory
  • High performance: fast access time, MX29GL512F H/L: 100ns (VCC=3.0~3.6V), 110ns (VCC=2.7~3.6V); MX29GL512F U/D: 110ns/120ns (VCC=2.7~3.6V, V I/O=1.65 to Vcc)
  • Page access time: MX29GL512F H/L: 25ns; MX29GL512F U/D: 30ns
  • Fast program time: 10µs/word
  • Fast erase time: 0.5s/sector
  • Low power consumption: low active read current, typical 10mA @ 5MHz; low standby current, typical 40µA
  • Minimum 100,000 erase/program cycles
  • 20-year data retention
  • Software features: program/erase suspend and resume; status revert; data polling and toggle bit for program and erase completion detection; CFI support
  • Hardware features: ready/busy output; hardware method for program and erase completion detection; hardware reset input; hardware method for resetting internal state machine to read mode; WP#/ACC input pin; hardware write protection pin/accelerated program capability
  • Package: 56-pin TSOP; 64-ball LFBGA (11mm x 13mm); 56-ball FBGA (7mm x 9mm); all devices are RoHS compliant and halogen-free