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RENESAS 71V35761SA166BGG8 product image
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RENESAS 71V35761SA166BGG8RoHS

Manufacturer
MPN
71V35761SA166BGG8
LCSC Part #
C6100718
Packaging
PBGA-119(14x22)
Customer #
Key Attributes
4.5Mbit 3.135V~3.465V Parallel Port (Parallel) PBGA-119(14x22) Memory RoHS
Datasheetpdf iconRENESAS 71V35761SA166BGG8
Alternative Parts19
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QtyUnit Price(Reference Only)Total Amount
1+$ 22.1401$ 22.14
200+$ 8.8342$ 1766.84
500+$ 8.5388$ 4269.40
1,000+$ 8.3933$ 8393.30
Standard Packaging1000/Full Reel
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerRENESAS
PackagingPBGA-119(14x22)
Operating Temperature0℃~+70℃
FeaturesAuto power-down function;Boundary scan (JTAG) function
Memory Size4.5Mbit
Voltage - Supply3.135V~3.465V
Access Time3.5ns
Current - Supply320mA
Standby Supply Current30mA
InterfaceParallel Port (Parallel)

Introduction

AI Translation

The IDT71V35761 are high-speed SRAMs organized as 128K x 36. The IDT71V35761 SRAMs contain write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as the IDT71V35761 can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will be pipelined for one cycle before it is available on the next rising clock edge. If burst mode operation is selected (ADV (overline) = 20W), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin. The IDT71V35761 SRAM utilizes a high-performance CMOS process and is packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and 165 fine pitch ball grid array(fBGA).

Features

AI Translation
  • 128K x 36 memory configurations
  • Supports high system speed:
    • Commercial: – 200MHz 3.1ns clock access time
    • Commercial and Industrial: 183MHz 3.3ns clock access time, 166MHz 3.5ns clock access time
  • LBO input selects interleaved or linear burst mode
  • 3.3V core power supply
  • Self-timed write cycle with global write control (GW (overline)), byte write enable (BWE), and byte writes (BWx)
  • Power down controlled by ZZ input
  • 3.3V I/O
  • Optional - Boundary Scan JTAG Interface (IEEE 1149.1 compliant)
  • Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array
  • Industrial temperature range ( -40℃ to +85℃ᵢ ) is available for selected speeds
  • Green parts available

Alternative Parts

MPNManufacturerPackagingAvailabilityUnit Price
71V35761SA166BGGRENESASPBGA-119(14x22)0$ 5.9903
71V35761S183BGRENESAS119-PBGA (14x22)0$ 18.0089
71V35761SA200BGRENESASPBGA-119(14x22)0$ 6.6525
71V35761S200BGGRENESASPBGA-119(14x22)0$ 3.0265
71V35761SA166BGIRENESASPBGA-119(14x22)0$ 6.6879
71V35761SA166BGGIRENESASPBGA-119(14x22)0$ 6.6879
71V35761S166BGGIRENESASPBGA-119(14x22)0$ 2.6475
IDT71V3577SA75BGGRENESAS119-PBGA (14x22)0$ 14.8315
IDT71V2556S133BG8RENESAS119-PBGA (14x22)0$ 11.2197
IDT71V2556S166BG8RENESAS119-PBGA (14x22)0$ 12.295
71V3556SA166BGIRENESASPBGA-119(14x22)0$ 9.9508
71V2556SA133BGIRENESASPBGA-119(14x22)0$ 23.5441
71V2556SA166BGRENESASPBGA-119(14x22)0$ 9.4924
71V2556SA133BGRENESASPBGA-119(14x22)0$ 9.1575
71V3577S75BGRENESASPBGA-119(14x22)0$ 4.9345
71V35761S166BGG8RENESAS119-PBGA (14x22)0$ 15.8035
71V35761S183BGGIRENESAS119-PBGA (14x22)0$ 20.1276
IDT71V3577SA80BG8RENESAS119-PBGA (14x22)0$ 13.0149
IDT71V3577SA80BGG8RENESAS119-PBGA (14x22)0$ 13.0149