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SiTime SIT1576AI-J1-33E-0200.000000 product image
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SiTime SIT1576AI-J1-33E-0200.000000

Manufacturer
MPN
SIT1576AI-J1-33E-0200.000000
LCSC Part #
C19166147
Packaging
UFBGA-4
Customer #
Key Attributes
200kHz UFBGA-4 Oscillators RoHS
DatasheetSiTime SIT1576AI-J1-33E-0200.000000
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QtyUnit Price(Reference Only)Total Amount
1+$ 3.0648$ 3.06
200+$ 1.2229$ 244.58
500+$ 1.1819$ 590.95
1,000+$ 1.1622$ 1162.20
Standard Packaging1000/Full Reel
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Products Specifications

All
TypeDescription
CategoryPassives/Crystals, Oscillators, Resonators/Oscillators
ManufacturerSiTime
PackagingUFBGA-4
Current - Supply16uA
Operating Temperature-40℃~+85℃
Frequency Stability±20ppm
Output TypeLVCMOS
Frequency200kHz
Voltage - Supply3.3V

Introduction

AI Translation

The SiT1576 is an ultra-small, ultra-low-power, factory-programmable TCXO with an output frequency range of 1 Hz to 2.5 MHz. SiTime's silicon MEMS technology enables this 1 Hz – 2.5 MHz TCXO to achieve the world's smallest footprint in a chip-scale package (CSP). Typical supply current is only 6 μA (at 100 kHz). SiTime's MEMS oscillator consists of a MEMS resonator and a programmable analog circuit. The SiT1576 MEMS resonator is fabricated using SiTime's proprietary MEMS First® process. The key manufacturing step is EpiSeal®, during which the MEMS resonator is annealed at temperatures exceeding 1000°C. EpiSeal creates an extremely robust, clean vacuum cavity that encapsulates the MEMS resonator, ensuring optimal performance and reliability. During the EpiSeal process, a polysilicon cap is grown on top of the resonator cavity, eliminating the need for an additional cap wafer or other special packaging. As a result, SiTime's MEMS resonator die can be handled like any other semiconductor die. A unique outcome of SiTime's MEMS First and EpiSeal manufacturing processes is the ability to integrate SiTime's MEMS die with a SoC, ASIC, microprocessor, or analog chip in a single package, eliminating external timing components and delivering a highly integrated, smaller, and more cost-effective solution for customers.

Features

AI Translation
  • 1 Hz to 2.5 MHz full-range frequency stability ±5 ppm
  • Factory-programmable output frequency
  • World's smallest TCXO footprint: 1.2 mm²
  • 1.5×0.8 mm chip-scale package (CSP)
  • No external bypass capacitor required
  • Improved stability with fewer network timing updates, reducing system power consumption
  • Ultra-low power consumption: 6 μA (100 kHz)
  • Supply voltage range: 1.62 V to 3.63 V
  • Operating temperature range: -20°C to +70°C, -40°C to +85°C
  • Lead-free, RoHS and REACH compliant

Applications

AI Translation

Health and fitness monitors, smart pens, ultra-low-power input devices, proprietary wireless devices, sensor interfaces