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Infineon CYBLE-333074-02

Fabricante
N.º de pieza fab.
CYBLE-333074-02
Nº LCSC
C7156428
Emb.
SMD-43P
Número de Cliente
Atrib. clave
SMD-43P RF Transceiver Modules and Modems RoHS
Hoja de DatosInfineon CYBLE-333074-02
Agotado
Avisarme
Mínimo: 1Múltiplo: 1Unidad de venta: Piece
Añadir a la Lista BOM
Cant.Prec. unit.(Solo como referencia)Importo total
1+$ 14.6393$ 14.64
200+$ 5.8427$ 1168.54
Encapsulado Estándar500/Full Reel
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Especificaciones del Producto

Todo
TipoDescripción
CategoríaRF and Wireless/RF Transceiver Modules and Modems
FabricanteInfineon
Emb.SMD-43P
FeaturesLow-power secure connection;Mesh networking;Encryption function

Descripción

Traducción por IA

The CYBLE-3x307x-02 is a fully integrated Bluetooth smart ready wireless module. The CYBLE-3x307x-02 includes an onboard crystal oscillator, passive components, flash memory, and the CYW20835 silicon device. The CYBLE-3x307x-02 supports peripheral functions (ADC and PWM), UART, I²C, and SPI communication, and a PCM/I²S audio interface. The CYBLE-3x307x-02 includes a royalty-free Bluetooth stack compatible with Bluetooth in a 13.31×21.89×1.95 mm package. The CYBLE-3x307x-02 includes 512 KB of onboard serial flash memory and is designed for standalone operation. The CYBLE-3x307x-02 uses an integrated power amplifier to achieve Class I or Class II output power capability. The CYBLE-3x307x-02 is fully qualified by Bluetooth and is targeted at applications requiring cost-optimized Bluetooth wireless connectivity. The CYBLE-3x307x-02 is offered in four certified versions CYBLE-343072-02, CYBLE-333073-02, and CYBLE-333074-02. The CYBLE-343072-02 includes an integrated trace antenna. The CYBLE-333073-02 supports an external antenna through a RF solder pad output. The CYBLE-333074-02 supports an external antenna via a u-FL connector.

Características

Traducción por IA
  • Module size: 13.31×21.89×1.95 mm
  • Bluetooth qualified smart ready module - QDID: TBD - Declaration ID: TBD
  • Certified to FCC, ISED, MIC, and CE regulations
  • Castelated solder pad connections for ease-of-use
  • 512-KB on-module serial flash memory
  • Up to 24 GPIOs
  • Temperature range: -30 °C to +85 °C
  • Cortex-M4 32-bit processor
  • Maximum TX output power - +12 dBm for Bluetooth Low Energy
  • Bluetooth LE connection range of up to 250 meters at 12 dBm
  • RX receive sensitivity: Bluetooth Low Energy: –94.5 dBm
  • 1x MIPI DMI-C interface
  • 6x 16-bit PWMs
  • Programmable key-scan matrix interface, up to 8×20 key scanning matrix
  • Quadrature decoder
  • Watchdog timer (WDT)
  • 1x peripheral UART, 1x UART for programming and HCI
  • 1x SPI (master or slave mode)
  • 1x I2C master
  • One ADC (10-ENoB for DC measurement and 12-ENOB for audio measurement)
  • Hardware security engine
  • Proven ready-to-use hardware design
  • Cost optimized for applications without space constraints
  • Nonvolatile memory for self-sufficient operation and over-the-air updates
  • Bluetooth SIG listed with QDID and declaration ID
  • Fully certified module eliminates the time needed for design, development, and certification processes
  • ModusToolbox provides an easy-to-use integrated design environment (IDE) to configure, develop, and program a Bluetooth application