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MICROCHIP ATWINC1500-MR210PB1172 product image
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MICROCHIP ATWINC1500-MR210PB1172

Manufacturer
MPN
ATWINC1500-MR210PB1172
LCSC Part #
C610420
Packaging
-
Customer #
Key Attributes
2.4GHz RF Transceiver Modules and Modems RoHS
DatasheetMICROCHIP ATWINC1500-MR210PB1172
RoHS Compliance1 documents available
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QtyUnit Price(Reference Only)Total Amount
1+$ 11.1192$ 11.12
200+$ 4.3032$ 860.64
500+$ 4.152$ 2076.00
1,000+$ 4.0779$ 4077.90
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Products Specifications

All
TypeDescription
CategoryRF and Wireless/RF Transceiver Modules and Modems
ManufacturerMICROCHIP
Packaging-
Frequency Range2.4GHz
Utilized IC / Part-
Output Power18.5dBm
InterfaceI2C;SPI;UART

Introduction

AI Translation

The ATWINC15x0-MR210xB is a low power consumption 802.11 b/g/n IoT (Internet of Things) module, specifically optimized for low power IoT applications. The module integrates Power Amplifier (PA), Low-Noise Amplifier (LNA), Switch, Power Management and a printed antenna or a micro co-ax (U.FL) connector for an external antenna resulting in a small form factor (21.7x14.7x2.1 mm) design. It is interoperable with various vendors’ 802.11 b/g/n access points. This module provides Serial Peripheral Interface (SPI) ports to interface with a host controller.

Features

AI Translation
  • IEEE 802.11 b/g/n 20 MHz (1x1) solution
  • Single spatial stream in 2.4 GHz ISM band
  • Integrated Transmit/Receive switch
  • Integrated PCB antenna or U.FL micro co-ax connector for external antenna
  • Superior sensitivity and range via advanced PHY signal processing
  • Advanced equalization and channel estimation
  • Advanced carrier and timing synchronization
  • Wi-Fi Direct (supported till firmware release 19.5.2)
  • Soft-AP support
  • Supports IEEE 802.11 WEP, WPA, WPA2 security
  • Support Enterprise security with WPA/WPA2 (802.1X) – EAP-TLS – EAP-PEAPv0/1 with TLS – EAP-TTLSv0 with MSCHAPv2 – EAP-PEAPv0/1 with MSCHAPv2
  • Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
  • On-chip memory management engine to reduce host load
  • SPI host interface
  • Operating temperature range from -40℃ to +85℃. RF performance at room temperature of 25℃ with a 2 - 3 dB change at boundary conditions
  • Power supply for I/O (VDDIO) rages from 2.7V to 3.6V
  • Power supply for DC/DC converter (VBAT) ranges from 3.0V to 4.2V
  • Built-in 26 MHz crystal
  • Integrated Flash memory for system software
  • Power Save modes:
    • 4 μA Power-Down mode typical at 3.3V I/O
    • 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
    • On-chip low power sleep oscillator
    • Fast host wake-up from Doze mode by a pin or SPI transaction
  • Fast Boot options:
    • On-chip boot ROM (Firmware instant boot)
    • SPI flash boot
    • Low-leakage on-chip memory for state variables
    • Fast AP re-association <150 ms>
  • On-chip Network stack to offload MCU:
    • Network features TCP, UDP, DHCP, ARP, HTTP, TLS and DNS
    • Hardware accelerators for Wi-Fi and TLS security to improve connection time
  • Hardware accelerator for IP checksum
  • Hardware accelerators for OTA security
  • Small footprint host driver
  • Wi-Fi Alliance certifications for Connectivity and Optimizations – ID: WFA61069