MACOM MA4E2514L-1116
| Manufacturer | |
| MPN | MA4E2514L-1116 |
| LCSC Part # | C5669061 |
| Packaging | - |
| Customer # | |
| Key Attributes | 20mA 300mV@1mA 5V RF Diodes |
| Datasheet | MACOM MA4E2514L-1116 |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/RF Diodes | |
| Manufacturer | MACOM | |
| Packaging | - | |
| Non-Repetitive Peak Forward Surge Current | - | |
| Current - Rectified | 20mA | |
| Diode Configuration | - | |
| Reverse Leakage Current (Ir) | - | |
| Operating Junction Temperature Range | -40℃~+150℃ | |
| Voltage - Forward(Vf@If) | 300mV@1mA | |
| Voltage - DC Reverse(Vr) | 5V |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/RF Diodes | |
| Manufacturer | MACOM | |
| Packaging | - | |
| Non-Repetitive Peak Forward Surge Current | - | |
| Current - Rectified | 20mA |
| Type | Description | |
|---|---|---|
| Diode Configuration | - | |
| Reverse Leakage Current (Ir) | - | |
| Operating Junction Temperature Range | -40℃~+150℃ | |
| Voltage - Forward(Vf@If) | 300mV@1mA | |
| Voltage - DC Reverse(Vr) | 5V |
Introduction
The MA4E2514 SURMOUNT Diode T-Type Series are silicon low-barrier and medium-barrier Schottky devices fabricated using a patented Heterolithic Microwave Integrated Circuit process. The HMIC circuit consists of silicon pillars forming diodes or via conductors, embedded in a glass dielectric that serves as a low-dispersion, low-loss microstrip transmission medium. The combination of silicon and glass enables HMIC devices to achieve excellent loss and power dissipation characteristics in a low-profile, reliable package.
SURMOUNT Schottky devices are an ideal choice for circuits requiring the low parasitics of beam-lead devices combined with the superior mechanical properties of chip devices. The SURMOUNT structure uses extremely low-resistance silicon vias to connect the Schottky contact to the metallized mounting pad on the bottom surface of the chip. These devices are reliable, repeatable, and offer a low-cost, high-performance alternative to conventional devices. They exhibit lower ESD sensitivity than conventional beam-lead Schottky diodes.
The multilayer metallization used in SURMOUNT Schottky junction fabrication includes a platinum diffusion barrier, enabling all devices to withstand a non-operating stability bake of 16 hours at 300°C.
The "0505" footprint allows surface-mount placement and versatile polarity orientation.
Case Style 1116.
Features
- Extremely low parasitic capacitance and inductance
- Surface-mountable in microwave circuits without bonding wires
- Robust HMIC structure with polyimide scratch protection layer
- Reliable multilayer metallization with diffusion barrier, 100% stability bake (300°C, 16 hours)
- Lower ESD damage susceptibility
Applications
- Mixer
- Subharmonic Mixer
- Detector
- Limiter
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/RF Diodes | |
| Manufacturer | MACOM | |
| Packaging | - | |
| Non-Repetitive Peak Forward Surge Current | - | |
| Current - Rectified | 20mA | |
| Diode Configuration | - | |
| Reverse Leakage Current (Ir) | - | |
| Operating Junction Temperature Range | -40℃~+150℃ | |
| Voltage - Forward(Vf@If) | 300mV@1mA | |
| Voltage - DC Reverse(Vr) | 5V |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Diodes/RF Diodes | |
| Manufacturer | MACOM | |
| Packaging | - | |
| Non-Repetitive Peak Forward Surge Current | - | |
| Current - Rectified | 20mA |
| Type | Description | |
|---|---|---|
| Diode Configuration | - | |
| Reverse Leakage Current (Ir) | - | |
| Operating Junction Temperature Range | -40℃~+150℃ | |
| Voltage - Forward(Vf@If) | 300mV@1mA | |
| Voltage - DC Reverse(Vr) | 5V |
Introduction
The MA4E2514 SURMOUNT Diode T-Type Series are silicon low-barrier and medium-barrier Schottky devices fabricated using a patented Heterolithic Microwave Integrated Circuit process. The HMIC circuit consists of silicon pillars forming diodes or via conductors, embedded in a glass dielectric that serves as a low-dispersion, low-loss microstrip transmission medium. The combination of silicon and glass enables HMIC devices to achieve excellent loss and power dissipation characteristics in a low-profile, reliable package.
SURMOUNT Schottky devices are an ideal choice for circuits requiring the low parasitics of beam-lead devices combined with the superior mechanical properties of chip devices. The SURMOUNT structure uses extremely low-resistance silicon vias to connect the Schottky contact to the metallized mounting pad on the bottom surface of the chip. These devices are reliable, repeatable, and offer a low-cost, high-performance alternative to conventional devices. They exhibit lower ESD sensitivity than conventional beam-lead Schottky diodes.
The multilayer metallization used in SURMOUNT Schottky junction fabrication includes a platinum diffusion barrier, enabling all devices to withstand a non-operating stability bake of 16 hours at 300°C.
The "0505" footprint allows surface-mount placement and versatile polarity orientation.
Case Style 1116.
Features
- Extremely low parasitic capacitance and inductance
- Surface-mountable in microwave circuits without bonding wires
- Robust HMIC structure with polyimide scratch protection layer
- Reliable multilayer metallization with diffusion barrier, 100% stability bake (300°C, 16 hours)
- Lower ESD damage susceptibility
Applications
- Mixer
- Subharmonic Mixer
- Detector
- Limiter
Compliance & Export Codes
| Type | Details |
|---|---|
| ECCN | EAR99 |
| CNHTS | 8541100000 |
| USHTS | 8541100040 |
| TARIC | 8541100000 |
| CAHTS | 8541100090 |
| BRHTS | 85411011 |
| INHTS | 85411000 |
| MXHTS | 8541.10.01 |
| Type | Details |
|---|---|
| ECCN | EAR99 |
| CNHTS | 8541100000 |
| USHTS | 8541100040 |
| TARIC | 8541100000 |
| Type | Details |
|---|---|
| CAHTS | 8541100090 |
| BRHTS | 85411011 |
| INHTS | 85411000 |
| MXHTS | 8541.10.01 |

