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MACOM MA4E2514L-1116

Manufacturer
MPN
MA4E2514L-1116
LCSC Part #
C5669061
Packaging
-
Customer #
Key Attributes
20mA 300mV@1mA 5V RF Diodes
DatasheetMACOM MA4E2514L-1116
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategoryDiscrete Semiconductors/Diodes/RF Diodes
ManufacturerMACOM
Packaging-
Non-Repetitive Peak Forward Surge Current-
Current - Rectified20mA
Diode Configuration-
Reverse Leakage Current (Ir)-
Operating Junction Temperature Range-40℃~+150℃
Voltage - Forward(Vf@If)300mV@1mA
Voltage - DC Reverse(Vr)5V

Introduction

AI Translation

The MA4E2514 SURMOUNT Diode T-Type Series are silicon low-barrier and medium-barrier Schottky devices fabricated using a patented Heterolithic Microwave Integrated Circuit process. The HMIC circuit consists of silicon pillars forming diodes or via conductors, embedded in a glass dielectric that serves as a low-dispersion, low-loss microstrip transmission medium. The combination of silicon and glass enables HMIC devices to achieve excellent loss and power dissipation characteristics in a low-profile, reliable package.

SURMOUNT Schottky devices are an ideal choice for circuits requiring the low parasitics of beam-lead devices combined with the superior mechanical properties of chip devices. The SURMOUNT structure uses extremely low-resistance silicon vias to connect the Schottky contact to the metallized mounting pad on the bottom surface of the chip. These devices are reliable, repeatable, and offer a low-cost, high-performance alternative to conventional devices. They exhibit lower ESD sensitivity than conventional beam-lead Schottky diodes.

The multilayer metallization used in SURMOUNT Schottky junction fabrication includes a platinum diffusion barrier, enabling all devices to withstand a non-operating stability bake of 16 hours at 300°C.

The "0505" footprint allows surface-mount placement and versatile polarity orientation.

Case Style 1116.

Features

AI Translation
  • Extremely low parasitic capacitance and inductance
  • Surface-mountable in microwave circuits without bonding wires
  • Robust HMIC structure with polyimide scratch protection layer
  • Reliable multilayer metallization with diffusion barrier, 100% stability bake (300°C, 16 hours)
  • Lower ESD damage susceptibility

Applications

AI Translation
  • Mixer
  • Subharmonic Mixer
  • Detector
  • Limiter