Broadcom HCPL-5400#100

These devices are single-channel and dual-channel hermetic optocouplers. All devices are manufactured and tested on certified production lines, with H-grade and K-grade devices included on the Qualified Manufacturers List. Standard ESD precautions are recommended during handling and assembly of these components to prevent damage or performance degradation from electrostatic discharge. Each channel contains an AlGaAs LED that is optically coupled to an integrated high-gain photodetector. This combination achieves extremely high data transmission capability. The detector features a threshold with hysteresis, typically providing 0.25mA differential-mode noise margin and minimizing the possibility of output signal jitter. The detector in single-channel devices has a three-state output stage that directly drives data buses without requiring pull-up resistors. All devices are compatible with TTL, STTL, LSTTL, and HCMOS logic families. The 35ns pulse width distortion specification guarantees a 10MBd signal rate at +125°C with 35% pulse width distortion. Package styles for these components include 8-pin DIP through-hole and ceramic leadless chip carrier. Devices are available with various lead-bend and plating options. Since each channel of every device listed in this datasheet uses the same electrical die, the maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts. Exceptions occasionally arise due to package differences and constraints, and are noted accordingly. Furthermore, all devices use the same package assembly processes and materials. These similarities provide the basis for using data obtained from one part to represent the performance of other parts with respect to die-related reliability and certain limited radiation test results. The maximum gold thickness for gold-plated leads is less than 100 microinches, with a typical value of 60 to 90 microinches. Tin-plated leads are Sn63/Pb37. All DIP devices share common VCC and ground. The LCCC package features isolated channels with separate VCC and ground connections. All diagrams are top views. No derating is required up to +125°C. Duty cycle must not exceed 5% and pulse width must not exceed 50μs. Applicable to single-channel products only. An external bypass capacitor of 0.01μF to 0.1μF must be connected between VCC and ground. Electrical characteristics test conditions: TA = -55°C to +125°C, 4.75V ≤ VCC ≤ 5.25V, 6mA ≤ IF(ON) ≤ 10mA, 0V ≤ VF(OFF) ≤ 0.7V, unless otherwise specified. Commercial parts are 100% tested at 25°C. SMD, H-grade, and K-grade parts are 100% tested at 25°C, 125°C, and -55°C. All typical values are measured at VCC = 5V, TA = 25°C, IF = 8mA, unless otherwise specified. Per channel. HCPL-6430, HCPL-6431, and HCPL-643K are dual-channel devices.

• Dual-marked device part numbers
• Manufactured and tested on certified production lines
• QML-38534, H and K grades
• Two hermetic package configurations
• High speed: 40M bit/s
• High common mode rejection, guaranteed 500V/μs
• 1500Vdc withstand test voltage
• Active totem-pole output
• Three-state output available
• High radiation hardness
• Functionally compatible with HCPL-2400/30
• Reliability data
• Compatible with TTL, STTL, LSTTL, and HCMOS logic families

• High-reliability systems
• High-speed logic system isolation
• Computer peripheral interfaces
• Pulse transformer replacement
• Ground loop elimination
• Harsh industrial environments
• High-speed disk drive I/O
• Digital isolation for ADC/DAC