GSI Technology GS81313LQ18GK-800I
| Manufacturer | GSI TechnologyAsian Brands |
| MPN | GS81313LQ18GK-800I |
| LCSC Part # | C5648117 |
| Packaging | BGA-260(14x22) |
| Customer # | |
| Key Attributes | 8Mbit BGA-260(14x22) Memory RoHS |
| Datasheet | GSI Technology GS81313LQ18GK-800I |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | GSI Technology | |
| Packaging | BGA-260(14x22) | |
| Operating Temperature | -40℃~+100℃ | |
| Features | Built-in ECC function;Boundary scan (JTAG) function | |
| Memory Size | 8Mbit | |
| Voltage - Supply | 1.2V~1.35V;1.9A | |
| Access Time | - | |
| Standby Supply Current | - | |
| Interface | - |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | GSI Technology | |
| Packaging | BGA-260(14x22) | |
| Operating Temperature | -40℃~+100℃ | |
| Features | Built-in ECC function;Boundary scan (JTAG) function |
| Type | Description | |
|---|---|---|
| Memory Size | 8Mbit | |
| Voltage - Supply | 1.2V~1.35V;1.9A | |
| Access Time | - | |
| Standby Supply Current | - | |
| Interface | - |
Introduction
SigmaQuad-IIIe ECCRAM is one half of the independent I/O in the high-performance ECCRAM family SigmaQuad-IIIe/SigmaDDR-IIIe. While very similar to GSI's second-generation network SRAM (SigmaQuad-II/SigmaDDR-II series), these third-generation devices offer several new features that help significantly improve performance. GSI's ECCRAM implements an ECC algorithm that detects and corrects all single-bit memory errors, including those caused by SER events such as cosmic rays, alpha particles, etc. The soft error rate of these devices is expected to be <0.002 FITs/Mb, representing a 5-order-of-magnitude improvement over comparable SRAMs without on-chip ECC, which typically exhibit SERs of 200 FITs/Mb or higher. All cited SER values are at sea level in New York City.
Features
- 4Mb x 36 and 8Mb x 18 organization
- Operating frequency 800 MHz
- Transaction rate 1.6 BT/s (billion transactions per second)
- Data bandwidth 115 Gb/s (in x36 devices)
- Independent I/O DDR data bus
- Non-multiplexed DDR address bus
- Two operations per clock cycle — read and write
- Burst length 2 read and write operations
- 3-cycle read latency
- On-chip ECC, near-zero soft error rate
- Core voltage 1.25V ~ 1.3V
- HSTL I/O interface voltage 1.2V ~ 1.3V
- Configurable ODT (On-Die Termination)
- ZQ pin for programmable driver impedance
- ZT pin for programmable ODT impedance
- IEEE 1149.1 JTAG-compliant boundary scan
- 260-pin, 14mm × 22mm, 1mm ball pitch, 6/6 RoHS-compliant BGA package
| Qty | Unit Price(Reference Only) | Total Amount |
|---|---|---|
| 1+ | $ 1215.0475 | $ 1215.05 |
| 200+ | $ 484.8119 | $ 96962.38 |
| 500+ | $ 468.6119 | $ 234305.95 |
| 1,000+ | $ 460.6066 | $ 460606.60 |
Standard Packaging10/Full Tray | ||
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | GSI Technology | |
| Packaging | BGA-260(14x22) | |
| Operating Temperature | -40℃~+100℃ | |
| Features | Built-in ECC function;Boundary scan (JTAG) function | |
| Memory Size | 8Mbit | |
| Voltage - Supply | 1.2V~1.35V;1.9A | |
| Access Time | - | |
| Standby Supply Current | - | |
| Interface | - |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | GSI Technology | |
| Packaging | BGA-260(14x22) | |
| Operating Temperature | -40℃~+100℃ | |
| Features | Built-in ECC function;Boundary scan (JTAG) function |
| Type | Description | |
|---|---|---|
| Memory Size | 8Mbit | |
| Voltage - Supply | 1.2V~1.35V;1.9A | |
| Access Time | - | |
| Standby Supply Current | - | |
| Interface | - |
Introduction
SigmaQuad-IIIe ECCRAM is one half of the independent I/O in the high-performance ECCRAM family SigmaQuad-IIIe/SigmaDDR-IIIe. While very similar to GSI's second-generation network SRAM (SigmaQuad-II/SigmaDDR-II series), these third-generation devices offer several new features that help significantly improve performance. GSI's ECCRAM implements an ECC algorithm that detects and corrects all single-bit memory errors, including those caused by SER events such as cosmic rays, alpha particles, etc. The soft error rate of these devices is expected to be <0.002 FITs/Mb, representing a 5-order-of-magnitude improvement over comparable SRAMs without on-chip ECC, which typically exhibit SERs of 200 FITs/Mb or higher. All cited SER values are at sea level in New York City.
Features
- 4Mb x 36 and 8Mb x 18 organization
- Operating frequency 800 MHz
- Transaction rate 1.6 BT/s (billion transactions per second)
- Data bandwidth 115 Gb/s (in x36 devices)
- Independent I/O DDR data bus
- Non-multiplexed DDR address bus
- Two operations per clock cycle — read and write
- Burst length 2 read and write operations
- 3-cycle read latency
- On-chip ECC, near-zero soft error rate
- Core voltage 1.25V ~ 1.3V
- HSTL I/O interface voltage 1.2V ~ 1.3V
- Configurable ODT (On-Die Termination)
- ZQ pin for programmable driver impedance
- ZT pin for programmable ODT impedance
- IEEE 1149.1 JTAG-compliant boundary scan
- 260-pin, 14mm × 22mm, 1mm ball pitch, 6/6 RoHS-compliant BGA package
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991B2B |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | 3A991B2B |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Type | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |

