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GSI Technology GS81313LQ18GK-800I product image
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GSI Technology GS81313LQ18GK-800I

Manufacturer
GSI TechnologyAsian Brands
MPN
GS81313LQ18GK-800I
LCSC Part #
C5648117
Packaging
BGA-260(14x22)
Customer #
Key Attributes
8Mbit BGA-260(14x22) Memory RoHS
DatasheetGSI Technology GS81313LQ18GK-800I
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QtyUnit Price(Reference Only)Total Amount
1+$ 1215.0475$ 1215.05
200+$ 484.8119$ 96962.38
500+$ 468.6119$ 234305.95
1,000+$ 460.6066$ 460606.60
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerGSI Technology
PackagingBGA-260(14x22)
Operating Temperature-40℃~+100℃
FeaturesBuilt-in ECC function;Boundary scan (JTAG) function
Memory Size8Mbit
Voltage - Supply1.2V~1.35V;1.9A
Access Time-
Standby Supply Current-
Interface-

Introduction

AI Translation

SigmaQuad-IIIe ECCRAM is one half of the independent I/O in the high-performance ECCRAM family SigmaQuad-IIIe/SigmaDDR-IIIe. While very similar to GSI's second-generation network SRAM (SigmaQuad-II/SigmaDDR-II series), these third-generation devices offer several new features that help significantly improve performance. GSI's ECCRAM implements an ECC algorithm that detects and corrects all single-bit memory errors, including those caused by SER events such as cosmic rays, alpha particles, etc. The soft error rate of these devices is expected to be <0.002 FITs/Mb, representing a 5-order-of-magnitude improvement over comparable SRAMs without on-chip ECC, which typically exhibit SERs of 200 FITs/Mb or higher. All cited SER values are at sea level in New York City.

Features

AI Translation
  • 4Mb x 36 and 8Mb x 18 organization
  • Operating frequency 800 MHz
  • Transaction rate 1.6 BT/s (billion transactions per second)
  • Data bandwidth 115 Gb/s (in x36 devices)
  • Independent I/O DDR data bus
  • Non-multiplexed DDR address bus
  • Two operations per clock cycle — read and write
  • Burst length 2 read and write operations
  • 3-cycle read latency
  • On-chip ECC, near-zero soft error rate
  • Core voltage 1.25V ~ 1.3V
  • HSTL I/O interface voltage 1.2V ~ 1.3V
  • Configurable ODT (On-Die Termination)
  • ZQ pin for programmable driver impedance
  • ZT pin for programmable ODT impedance
  • IEEE 1149.1 JTAG-compliant boundary scan
  • 260-pin, 14mm × 22mm, 1mm ball pitch, 6/6 RoHS-compliant BGA package