LCSC Electronics logoLCSC Electronics svg logo
Sign In
USD

ST LSM6DSV16BXTR

Manufacturer
MPN
LSM6DSV16BXTR
LCSC Part #
C5267394
Packaging
LGA-14(2.5x3)
Customer #
Key Attributes
LGA-14(2.5x3) IMUs (Inertial Measurement Units) RoHS
DatasheetST LSM6DSV16BXTR
RoHS Compliance3 documents available
Alternative Parts5
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategorySensors, Transducers/Motion Sensors/IMUs (Inertial Measurement Units)
ManufacturerST
PackagingLGA-14(2.5x3)
Output Bits-
Accelerometer Sensing AxisX,Y,Z
Cache Size4.5KB
Standby Current-
Acceleration Measurement Range (MAX)±16g

Introduction

AI Translation

The LSM6DSV16BX is a system-in-package IMU integrating a 3-axis digital accelerometer and a 3-axis digital gyroscope. It features three dedicated channels for processing acceleration and angular rate data for motion tracking (user interface, device power management, gaming 3D head tracking, and enhanced audio experience), bone-conducted vibration detection, and Qvar sensing, with each channel having its own dedicated configuration, processing, and filtering. Motion tracking power consumption in high-performance mode is 0.6 mA, with Always-on low-power capability for an optimized motion experience. The device embeds advanced dedicated features and data processing functions — including FSM, SFLP, ASC, and MLC with exportable AI features/filters — making it well suited for IoT applications. It integrates a 6-axis IMU sensor with audio accelerometer functionality in a compact package (2.5×3.0×0.71 mm). Additionally, it embeds an analog hub for connecting external analog inputs and converting them to digital signals for processing, along with advanced dedicated features such as finite state machine and data filtering for motion processing. Event detection interrupts enable efficient and reliable motion tracking and context awareness, with hardware recognition of free-fall events, 6D orientation, single- and double-tap sensing, activity/inactivity detection, stationary/motion detection, and wake-up events. Machine learning and FSM processing allow offloading portions of algorithms from the application processor to the LSM6DSV16BX sensor, continuously reducing power consumption. The embedded FIFO with compression and dynamic allocation of significant data reduces overall system power consumption, with a FIFO buffer size of up to 4.5 KB. This MEMS sensor module is manufactured using a proven in-house process for producing micromachined accelerometers and gyroscopes. The various sensing elements are fabricated using dedicated micromachining processes, while the IC interface is developed in CMOS technology, enabling the design of dedicated circuits tuned to better match the characteristics of the sensing elements. The product is housed in a small plastic LGA package measuring 2.5×3.0×0.71 mm, suitable for ultra-compact solutions.

Features

AI Translation
  • Three-channel sensing with motion tracking, bone conduction, and Qvar
  • Combined high-performance mode current consumption: 0.95 mA
  • Accelerometer and gyroscope both support low-power always-on operation
  • Smart FIFO up to 4.5 KB
  • Accelerometer full-scale range: ±2/±4/±8/±16 g
  • Gyroscope full-scale range: ±125/±250/±500/±1000/±2000/±4000 dps
  • 3-axis audio accelerometer with bandwidth >1 kHz and noise as low as 20 μg/√Hz
  • SPI/I²C and MIPI I3C® v1.1 serial interfaces for host processor data synchronization
  • TDM slave interface
  • Advanced pedometer, step detector, and step counter
  • Significant motion detection, tilt detection
  • Standard interrupts: free-fall, wake-up, 6D orientation, single and double tap
  • Programmable finite state machine for high-rate 960 Hz processing of accelerometer, gyroscope, and Qvar sensor data
  • Machine learning core with exportable features and filters for AI applications
  • Embedded adaptive self-configuration (ASC)
  • Embedded Qvar: charge variation detection
  • Embedded analog hub for ADC and analog input data processing
  • Embedded sensor fusion low-power algorithm
  • Embedded temperature sensor
  • Analog supply voltage: 1.71 V to 3.6 V
  • Separate IO supply (extended range: 1.08 V to 3.6 V)
  • Compact footprint: 2.5 mm × 3 mm × 0.71 mm
  • ECOPACK and RoHS compliant
  • 4.5 KB FIFO data buffer with 2× or 3× data compression
  • 100% efficiency under flexible configuration and partitioning
  • Timestamp storage support
  • Event detection interrupts (fully configurable): free-fall, wake-up, 6D orientation, single and double tap, activity/inactivity recognition, stationary/motion detection
  • Dedicated IP blocks ("embedded functions") with negligible power consumption and high performance: pedometer functions (step detector and step counter), tilt, significant motion

Applications

AI Translation
  • TWS (True Wireless Stereo)
  • Wearables
  • IoT and connected devices
  • UI and power management for wearable and hearable devices