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Nexperia BUK7S0R5-40HJ

Manufacturer
Nexperia
MPN
BUK7S0R5-40HJ
LCSC Part #
C3288643
Packaging
LFPAK-56
Customer #
Key Attributes
MOSFET N-CH 40V 500A LFPAK-56
DatasheetNexperia BUK7S0R5-40HJ
RoHS Compliance2 documents available
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement
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QtyUnit Price(Reference Only)Total Amount
1+$ 16.5566$ 16.56
10+$ 16.4169$ 164.17
30+$ 16.3243$ 489.73
100+$ 16.2317$ 1623.17
Standard Packaging2000/Full Reel
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Products Specifications

All
TypeDescription
CategoryDiscrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs
ManufacturerNexperia
PackagingLFPAK-56
Output Capacitance(Coss)3.805nF
Ciss-Input Capacitance21.162nF
Pd - Power Dissipation375W
Configuration-
Operating Temperature-55℃~+175℃
Drain to Source Voltage40V
Current - Continuous Drain(Id)500A
Reverse Transfer Capacitance (Crss)1.197nF
RDS(on)0.55mΩ@10V
Number1 N-channel
Gate Charge(Qg)65nC@10V
Vgs-
Gate Threshold Voltage (Vgs(th))3.6V
TypeN-Channel
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Introduction

AI Translation

Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.

Features

AI Translation
  • Fully automotive qualified to beyond AEC-Q101: -55℃ to +175℃ rating suitable for thermally demanding environments
  • LFPAK88 package: Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
  • Thin package and copper clip enables LFPAK88 to be highly efficient thermally
  • LFPAK copper clip technology enabling improvements over wire bond packages by: Increased maximum current capability and excellent current spreading, Improved RDSon, Low source inductance, Low thermal resistance Rth
  • LFPAK Gull Wing leads: Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
  • Visual (AOI) soldering inspection, no need for expensive x-ray equipment
  • Easy solder wetting for good mechanical solder joint
  • Unique 40 V Trench 9 superjunction technology: Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
  • Improved SOA and avalanche capability compared to standard TrenchMOS
  • Tight VGS(th) limits enable easy paralleling of MOSFETs

Applications

AI Translation
  • 12 V automotive systems
  • 48 V DC/DC systems (on 12 V secondary side)
  • Higher power motors, lamps and solenoid control
  • Reverse polarity protection
  • Ultra high performance power switching