TI AM3703CBCA

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption. The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

• Compatible with OMAP™3 Architecture
• Sitara™ ARM® Microprocessor (MPU) Subsystem Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
• Supports NEON™ SIMD Coprocessor
• POWERVR SGX™ Graphics Accelerator (AM3715 only)
• Tile Based Architecture Delivering up to 20 MPoly/sec
• Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
• Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
• Fine Grained Task Switching, Load Balancing, and Power Management
• Programmable High Quality Image Anti-Aliasing
• External Memory Interfaces: SDRAM Controller (SDRC) – 16, 32-bit Memory Controller With 1G-Byte Total Address Space
• Interfaces to Low-Power SDRAM
• SDRAM Memory Scheduler (SMS) and Rotation Engine
• General Purpose Memory Controller (GPMC) 16-bit Wide Multiplexed Address/Data Bus Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
• Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
• Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
• Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)
• 1.8-V I/O and 3.0-V (MMC1 only), 0.9-V to 1.2-V Adaptive Processor Core Voltage 0.9-V to 1.1-V Adaptive Core Logic Voltage
• Commercial, Industrial, and Extended Temperature Grades
• Serial Communication 5 Multichannel Buffered Serial Ports (McBSPs) – 512 Byte Transmit/Receive Buffer (McBSP1/3/4/5) 5K-Byte Transmit/Receive Buffer (McBSP2)
• SIDETONE Core Support (McBSP2 and 3 Only) For Filter, Gain, and Mix Operations
• Direct Interface to I2S and PCM Device and T Buses
• 128 Channel Transmit/Receive Mode
• Four Master/Slave Multichannel Serial Port Interface (McSPI) Ports
• High-Speed/Full-Speed/Low-Speed USB OTG Subsystem (12-/8-Pin ULPI Interface)
• High-Speed/Full-Speed/Low-Speed Multiport USB Host Subsystem – 12-/8-Pin ULPI Interface or 6-/4-/3-Pin Serial Interface
• One HDQ/1-Wire Interface
• Four UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
• Three Master/Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
• Camera Image Signal Processing (ISP) • CCD and CMOS Imager Interface • Memory Data Input • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/10-Bit) Interface
• Glueless Interface to Common Video Decoders
• Resize Engine Resize Images From 1/4x to 4x Separate Horizontal/Vertical Control
• System Direct Memory Access (SDMA) Controller (32 Logical Channels With Configurable Priority)
• Comprehensive Power, Reset, and Clock Management SmartReflexTM Technology Dynamic Voltage and Frequency Scaling (DVFS)
• Sitara™ ARM® Cortex™-A8 Core • ARMv7 Architecture – TrustZone® – Thumb®-2 MMU Enhancements
• In-Order, Dual-Issue, Superscalar Microprocessor Core
• NEON Multimedia Architecture Over 2x Performance of ARMv6 SIMD Supports Both Integer and Floating Point SIMD
• Jazelle® RCT Execution Environment Architecture
• Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
• Embedded Trace Macrocell (ETM)
• Support for Non-Invasive Debug
• ARM Cortex-A8 Memory Architecture: • 32K-Byte Instruction Cache (4-Way Set-Associative) • 32K-Byte Data Cache (4-Way Set-Associative) • 256K-Byte L2 Cache
• 32K-Byte ROM
• 64K-Byte Shared SRAM
• Endianess: • ARM Instructions - Little Endian • ARM Data – Configurable
• Removable Media Interfaces: – Three Multimedia Card (MMC)/ Secure Digital (SD) With Secure Data I/O (SDIO)
• Test Interfaces – IEEE-1149.1 (JTAG) Boundary-Scan Compatible – Embedded Trace Macro Interface (ETM) – Serial Data Transport Interface (SDTI)
• 12 32-bit General Purpose Timers
• 2 32-bit Watchdog Timers
• 1 32-bit Secure Watchdog Timer
• 1 32-bit 32-kHz Sync Timer
• Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
• 45-nm CMOS Technology
• Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
• Packages: – 515-pin s-PBGA package (CBP Suffix), .5mm Ball Pitch (Top), .4mm Ball Pitch (Bottom) – 515-pin s-PBGA package (CBC Suffix), .65mm Ball Pitch (Top), .5mm Ball Pitch (Bottom) – 423-pin s-PBGA package (CUS Suffix), .65mm Ball Pitch

• Portable Data Terminals
• Navigation
• Auto Infotainment
• Gaming
• Medical Imaging
• Home Automation Human Machine Interface
• Industrial Control
• Test and Measurement Single-board Computer