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TI F28M36H33B2ZWTT

Manufacturer
MPN
F28M36H33B2ZWTT
LCSC Part #
C3220132
Packaging
NFBGA-289
Customer #
Key Attributes
275MIPS, 1024kB flash dual-core 32-bit MCU of the C2000™ series
DatasheetTI F28M36H33B2ZWTT
RoHS Compliance1 documents available
Alternative Parts5
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerTI
PackagingNFBGA-289
ADC (Bit)12bit
Number of I/O142
Operating Temperature-40℃~+105℃@(TJ)
Program Memory TypeFLASH
Voltage - Supply1.14V~3.63V
EEPROM-
Program Storage Size512KB
CPU CoreARM Cortex-M3
Core Size32 Bit
CPU Maximum Speed100MHz;150MHz
Oscillator TypeBuilt-in

Introduction

AI Translation

Concerto series is a multi-core system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M36x series devices are the second series of Concerto products.

The communication subsystem is based on the industry-standard 32-bit ARM Cortex-M3 CPU and features a variety of communication peripherals (including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C) and an external interface.

The real-time control subsystem is based on TI's proprietary 32-bit C28x floating-point CPU and features the most flexible and highly accurate control peripherals, including fault-protected ePWM, encoder, and capture units - all implemented by TI's TMS320C2000 Piccolo and Delfino series products. In addition, the C28-CPU has been enhanced with a new VCU instruction accelerator capable of efficient Viterbi, complex arithmetic, 16-bit Fast Fourier Transform (FFT), and Cyclic Redundancy Check (CRC) algorithms.

It shares a high-speed analog subsystem and supplementary RAM memory, as well as on-chip voltage regulation and redundant timing circuits. Security considerations also include Error Correction Code (ECC), parity checking, and code secure memory, as well as documentation to assist with system-level industrial safety certification.

Features

AI Translation
  • Master Subsystem — ARM Cortex-M3
    • 125MHz
    • Embedded Memory
      • Up to 1MB Flash (ECC)
      • Up to 128KB RAM (ECC or Parity)
      • Up to 64KB Shared RAM
      • 2KB IPC Message RAM
    • Five UARTs
    • Four SSIs and one SPI
    • Two I²C
    • USB-OTG + PHY
    • 10/100 ENET 1588 MII
    • Two CAN modules (pin-bootable)
    • 32-channel μDMA
    • Dual security zones (128-bit password per zone)
    • EPI
    • μCRC module
    • Four general-purpose timers
    • Two watchdog timer modules
    • Endianness: Little-endian
  • Clocking
    • On-chip crystal oscillator and external clock input
    • Dynamic PLL ratio change supported
  • 1.2V digital, 1.8V analog, 3.3V I/O design
  • IPC
    • 32 handshake channels
    • Four channels generate IPC interrupts
    • Usable for coordinating data transfers via IPC message RAM
  • Up to 142 independently programmable, multiplexed GPIO pins
    • Glitch-free pulse I/O
  • Control Subsystem — TMS320C28x 32-bit CPU
    • 150MHz
    • C28x core hardware built-in self-test
    • Embedded Memory
      • Up to 512KB Flash (ECC)
      • Up to 36KB RAM (ECC or Parity)
      • Up to 64KB Shared RAM
      • 2KB IPC Message RAM
    • IEEE-754 single-precision FPU
    • Viterbi, complex math, and CRC unit (VCU)
    • SCI
    • SPI
    • I2C
    • 6-channel DMA
    • 12 ePWM modules
      • 24 outputs (16 high-resolution)
    • Six 32-bit eCAP modules
    • Three 32-bit eQEP modules
    • McBSP
    • EPI
    • One security zone (128-bit password)
    • Three 32-bit timers
    • Endianness: Little-endian
  • Analog Subsystem
    • Dual 12-bit ADC
    • Up to 2.88MSPS
    • Up to 24 channels
    • Four S/H circuits
    • Up to six comparators with 10-bit DAC
  • Package
    • 289-ball ZWT nFBGA
  • Temperature Options:
    • T: -40°C to 105°C (junction temperature)
    • S: -40°C to 125°C (junction temperature)
    • Q: –40ºC to 125°C (still air) (Q100 qualified for automotive applications)

Applications

AI Translation
  • Solar inverters
  • EV/HEV chargers
  • Power line communication