Infineon IRLR2905TRPBF
| Manufacturer | |
| MPN | IRLR2905TRPBF |
| LCSC Part # | C3010 |
| Packaging | DPAK(TO-252AA) |
| Customer # | |
| Key Attributes | MOSFET N-CH 55V 42A DPAK(TO-252AA) |
| Datasheet | Infineon IRLR2905TRPBF |
| RoHS Compliance | 1 documents available |
| Alternative Parts | 5 |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | Infineon | |
| Packaging | DPAK(TO-252AA) | |
| Output Capacitance(Coss) | 400pF | |
| Ciss-Input Capacitance | 1.7nF | |
| Pd - Power Dissipation | 110W | |
| Configuration | - | |
| Operating Temperature | -55℃~+175℃ | |
| Drain to Source Voltage | 55V | |
| Current - Continuous Drain(Id) | 42A | |
| Reverse Transfer Capacitance (Crss) | 150pF | |
| RDS(on) | 27mΩ@10V | |
| Number | 1 N-channel | |
| Gate Charge(Qg) | 48nC | |
| Vgs | ±16V | |
| Gate Threshold Voltage (Vgs(th)) | 2V | |
| Type | N-Channel |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | Infineon | |
| Packaging | DPAK(TO-252AA) | |
| Output Capacitance(Coss) | 400pF | |
| Ciss-Input Capacitance | 1.7nF | |
| Pd - Power Dissipation | 110W | |
| Configuration | - | |
| Operating Temperature | -55℃~+175℃ | |
| Drain to Source Voltage | 55V |
| Type | Description | |
|---|---|---|
| Current - Continuous Drain(Id) | 42A | |
| Reverse Transfer Capacitance (Crss) | 150pF | |
| RDS(on) | 27mΩ@10V | |
| Number | 1 N-channel | |
| Gate Charge(Qg) | 48nC | |
| Vgs | ±16V | |
| Gate Threshold Voltage (Vgs(th)) | 2V | |
| Type | N-Channel |
Introduction
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.
Features
- Logic level gate drive
- Ultra-low on-resistance
- Surface mount (IRLR2905)
- Straight lead (IRLU2905)
- Advanced process technology
- Fast switching
- Fully avalanche rated
- Lead-free
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | Infineon | |
| Packaging | DPAK(TO-252AA) | |
| Output Capacitance(Coss) | 400pF | |
| Ciss-Input Capacitance | 1.7nF | |
| Pd - Power Dissipation | 110W | |
| Configuration | - | |
| Operating Temperature | -55℃~+175℃ | |
| Drain to Source Voltage | 55V | |
| Current - Continuous Drain(Id) | 42A | |
| Reverse Transfer Capacitance (Crss) | 150pF | |
| RDS(on) | 27mΩ@10V | |
| Number | 1 N-channel | |
| Gate Charge(Qg) | 48nC | |
| Vgs | ±16V | |
| Gate Threshold Voltage (Vgs(th)) | 2V | |
| Type | N-Channel |
| Type | Description | |
|---|---|---|
| Category | Discrete Semiconductors/Transistors/FETs, MOSFETs/Single FETs, MOSFETs | |
| Manufacturer | Infineon | |
| Packaging | DPAK(TO-252AA) | |
| Output Capacitance(Coss) | 400pF | |
| Ciss-Input Capacitance | 1.7nF | |
| Pd - Power Dissipation | 110W | |
| Configuration | - | |
| Operating Temperature | -55℃~+175℃ | |
| Drain to Source Voltage | 55V |
| Type | Description | |
|---|---|---|
| Current - Continuous Drain(Id) | 42A | |
| Reverse Transfer Capacitance (Crss) | 150pF | |
| RDS(on) | 27mΩ@10V | |
| Number | 1 N-channel | |
| Gate Charge(Qg) | 48nC | |
| Vgs | ±16V | |
| Gate Threshold Voltage (Vgs(th)) | 2V | |
| Type | N-Channel |
Introduction
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.
Features
- Logic level gate drive
- Ultra-low on-resistance
- Surface mount (IRLR2905)
- Straight lead (IRLU2905)
- Advanced process technology
- Fast switching
- Fully avalanche rated
- Lead-free
C3010 EasyEDA Library
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |
| Type | Details |
|---|---|
| RoHS | ROHS3 Compliant |
| ECCN | EAR99 |
| CNHTS | 8541290000 |
| USHTS | 8541290095 |
| TARIC | 8541290000 |
| Type | Details |
|---|---|
| CAHTS | 8541290000 |
| BRHTS | 85412910 |
| INHTS | 85412900 |
| MXHTS | 8541.29.99 |



