Nanya Tech NT5TU32M16FG-AC
| Manufacturer | Nanya TechAsian Brands |
| MPN | NT5TU32M16FG-AC |
| LCSC Part # | C2903553 |
| Packaging | VFBGA-84 |
| Customer # | |
| Key Attributes | DDR2 512Mb SDRAM |
| Datasheet | Nanya Tech NT5TU32M16FG-AC |
| RoHS Compliance | 1 documents available |
| Alternative Parts | 5 |
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | Nanya Tech | |
| Packaging | VFBGA-84 | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Auto precharge function;Data mask function;Dynamic on-chip termination | |
| Refresh Current | 11mA | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 47mA;1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | Nanya Tech | |
| Packaging | VFBGA-84 | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Auto precharge function;Data mask function;Dynamic on-chip termination |
| Type | Description | |
|---|---|---|
| Refresh Current | 11mA | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 47mA;1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM |
Introduction
The 512Mb DDR2 SDRAM is a high - speed CMOS, dynamic random - access memory containing 536,870,912 bits. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for the burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Activate command, which is followed by a Read or Write command. The address bits registered coincident with the activate command are used to select the bank and row to be accesses (BA0 - BA1 select the bank, A0 - A13 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst access and to determine if the Auto - Precharge command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command description and device operation.
Features
- Double - data rate on DQs, DQS, DM bus - 4n Prefetch Architecture
- Throughput of valid Commands - Posted CAS and Additive Latency (AL)
- Configurable DS for system compatibility - Configurable On - Die Termination
- Auto Refresh and Self Refresh Modes
- Power Down Mode
- Partial Array Self Refresh (PASR)
- SSTL_18 compliance and Power Supply: VDD/VDDQ = 1.70 to 1.90V
- Output Drive Impedance (Full, Reduced)
- Burst Length (4, 8)
- Burst Type (Sequential, Interleaved)
- Rtt (50, 75, 150)
- CAS Latency (5, 6, 7)
- Additive Latency (0, 1, 2, 3, 4, 5, 6)
- WR (2, 3, 4, 5, 6, 7, 8)
- PASR (full, 3/4, 1/2, 1/4)
- Lead - free RoHS compliance and Halogen - free
Products Specifications
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | Nanya Tech | |
| Packaging | VFBGA-84 | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Auto precharge function;Data mask function;Dynamic on-chip termination | |
| Refresh Current | 11mA | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 47mA;1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM |
| Type | Description | |
|---|---|---|
| Category | Integrated Circuits (ICs)/Memory/Memory | |
| Manufacturer | Nanya Tech | |
| Packaging | VFBGA-84 | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Auto precharge function;Data mask function;Dynamic on-chip termination |
| Type | Description | |
|---|---|---|
| Refresh Current | 11mA | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 47mA;1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM |
Introduction
The 512Mb DDR2 SDRAM is a high - speed CMOS, dynamic random - access memory containing 536,870,912 bits. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for the burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Activate command, which is followed by a Read or Write command. The address bits registered coincident with the activate command are used to select the bank and row to be accesses (BA0 - BA1 select the bank, A0 - A13 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst access and to determine if the Auto - Precharge command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command description and device operation.
Features
- Double - data rate on DQs, DQS, DM bus - 4n Prefetch Architecture
- Throughput of valid Commands - Posted CAS and Additive Latency (AL)
- Configurable DS for system compatibility - Configurable On - Die Termination
- Auto Refresh and Self Refresh Modes
- Power Down Mode
- Partial Array Self Refresh (PASR)
- SSTL_18 compliance and Power Supply: VDD/VDDQ = 1.70 to 1.90V
- Output Drive Impedance (Full, Reduced)
- Burst Length (4, 8)
- Burst Type (Sequential, Interleaved)
- Rtt (50, 75, 150)
- CAS Latency (5, 6, 7)
- Additive Latency (0, 1, 2, 3, 4, 5, 6)
- WR (2, 3, 4, 5, 6, 7, 8)
- PASR (full, 3/4, 1/2, 1/4)
- Lead - free RoHS compliance and Halogen - free
C2903553 EasyEDA Library
Compliance & Export Codes
| Type | Details |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | EAR99 |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Type | Details |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | EAR99 |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Type | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |



