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TI AM5749ABZX

Manufacturer
MPN
AM5749ABZX
LCSC Part #
C2869793
Packaging
FCBGA-760
Customer #
Key Attributes
Sitara processor: dual-core Arm Cortex-A15 and dual-core DSP, multimedia, DDR with ECC support, secure boot, deep learning
DatasheetTI AM5749ABZX
RoHS Compliance1 documents available
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QtyUnit Price(Reference Only)Total Amount
1+$ 197.0916$ 197.09
200+$ 76.2717$ 15254.34
500+$ 73.5923$ 36796.15
1,000+$ 72.2669$ 72266.90
Standard Packaging60/Full Reel
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microprocessors
ManufacturerTI
PackagingFCBGA-760
CPU CoreARM Cortex-ASeries
CPU Maximum Speed1.5GHz

Introduction

AI Translation

The AM574x Sitara Arm application processors are designed to meet the intensive processing demands of modern embedded products. AM574x devices deliver high processing performance through their highly flexible, fully integrated hybrid processor solutions. These devices also seamlessly combine programmable video processing capabilities with a highly integrated peripheral set. Each AM574x device features cryptographic acceleration. The dual-core Arm Cortex-A15 RISC CPU with Neon extensions and two TI C66x VLIW floating-point DSP cores provide programmability. With Arm, developers can separate control functions from other algorithms programmed on the DSP and coprocessors, reducing system software complexity. Each device features cryptographic acceleration. High Security (HS) devices also provide all other supported security features, including secure boot support, debug security, and Trusted Execution Environment support.

Features

AI Translation
  • Arm Cortex-A15 dual-core microprocessor subsystem
  • Up to two C66x floating-point VLIW DSPs – object code fully compatible with C67x and Gfx+ – up to 32 16×16-bit fixed-point multiplications per cycle
  • On-chip L3 RAM up to 2.5MB
  • Two DDR3/DDR3L memory interface (EMIF) modules – up to DDR3-1333 speed – up to 2GB per EMIF – ECC support on primary EMIF
  • 2 dual-core Arm Cortex-M4 coprocessors (IPU1 and IPU2)
  • Up to 2 Embedded Vision Engines (EVE)
  • IVA-HD subsystem – 4K @ 15fps encode and decode support for H.264 codec – other codecs up to 1080p60
  • Display subsystem – full HD video (1920×1080p, 60fps) – multiple video inputs and outputs – 2D and 3D graphics – display controller with DMA engine and up to 3 pipelines – HDMI encoder: compatible with HDMI 1.4a and DVI 1.0
  • 2 dual-core Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS)
  • 2D graphics accelerator (BB2D) subsystem – Vivante GC320 core
  • Video Processing Engine (VPE)
  • Dual-core PowerVR SGX544 3D GPU
  • Secure boot support – hardware-enforced root of trust – customer-programmable keys and OTP data – takeover protection, IP protection, and anti-rollback protection
  • Cryptographic acceleration support – cryptographic core support – AES – 128/192/256-bit key sizes – 3DES – 56/112/168-bit key sizes – MD5, SHA1 – SHA2 – 224/256/384/512 – true random number generator – DMA support
  • Debug security – secure software-controlled debug access – security-aware debug
  • Trusted Execution Environment (TEE) support – Arm TrustZone-based TEE with extensive firewall support for isolation – secure DMA path and interconnect – secure monitor/timer/IPC
  • 2 Video Input Port (VIP) modules – up to 8 multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-port Gigabit Ethernet (GMAC)
  • 16 × 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • 5 I²C ports
  • HDQ/1-Wire interface
  • 10 configurable UART/IrDA/CIR modules
  • 4 multichannel SPI (McSPI) interfaces
  • Quad SPI interface (QSPI)
  • SATA Gen 2 interface
  • 8 multichannel audio serial port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High-Speed USB 2.0 dual-role device
  • Four MMC/SD/SDIO interfaces
  • PCIe 3.0 subsystem with two 5Gbps lanes – 1 dual-lane port compatible with Gen 2 – or 2 single-lane ports compatible with Gen 2
  • Up to 2 Controller Area Network (DCAN) modules – CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module – CAN 2.0B protocol with FD (Flexible Data Rate) capability
  • Up to 247 GPIO pins
  • Power, reset, and clock management
  • On-chip debug with CTool technology
  • 28nm CMOS technology
  • 23mm×23mm, 0.8mm pitch, 760-pin BGA (ABZ)

Applications

AI Translation
  • Industrial Communication
  • Human-Machine Interface (HMI)
  • Automation & Control
  • High-Performance Applications
  • Other General-Purpose Use