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KIOXIA THGAMRG8T13BAIL

Manufacturer
KIOXIA
MPN
THGAMRG8T13BAIL
LCSC Part #
C2837691
Packaging
BGA-153
Customer #
Key Attributes
e-MMC Module
DatasheetKIOXIA THGAMRG8T13BAIL
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerKIOXIA
PackagingBGA-153
Operating Temperature-25℃~+85℃
FeaturesBad block management function;Hardware reset function
Memory Size32GB
Reading Speed in Sequence310MB/S
Writing Speed in Sequence110MB/S
NAND Flash Type-
NAND Stand-By Current-
Controller Stand-By Current-
NAND Operating Voltage (VCCF)2.7V~3.6V
InterfaceeMMC 5.1
Controller Operating Voltage (VCCQ)1.7V~1.95V
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Introduction

AI Translation

THGAMRG8T13BAIL is 32GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGAMRG8T13BAIL has an industry standard MMC protocol for easy use.

Features

AI Translation
  • THGAMRG8T13BAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mod