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TI SN74AUP1G17DPWR product image
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TI SN74AUP1G17DPWRRoHS

Manufacturer
TI
MPN
SN74AUP1G17DPWR
LCSC Part #
C2675707
Packaging
X2-SON-5-EP(0.8x0.8)
Customer #
Key Attributes
Schmitt trigger 0.8V~3.6V 1 1 5.1ns@3.3V,5pF 900nA X2-SON-5-EP(0.8x0.8) Buffers, Drivers, Receivers, Transceivers RoHS
Datasheetpdf iconTI SN74AUP1G17DPWR
In-Stock: 240
240 In stock, ships now
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QtyUnit PriceTotal Amount
1+$ 0.2561$ 0.26
10+$ 0.2496$ 2.50
30+$ 0.2447$ 7.34
100+$ 0.2399$ 23.99
Standard Packaging3000/Full Reel
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Logic/Buffers, Drivers, Receivers, Transceivers
ManufacturerTI
PackagingX2-SON-5-EP(0.8x0.8)
Current - Output High(IOH)4mA
Input typeSchmitt trigger
SeriesAUP
Voltage - Supply0.8V~3.6V
Operating Temperature-40℃~+85℃
Current - Output Low(IOL)4mA
Output TypePush-pull
Number of Bits per Element1
Channel TypeUnidirectional
FeaturesPower-off isolation
Number of Elements1
Propagation Delay5.1ns@3.3V,5pF
Quiescent Current900nA
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging3000
Sales UnitPiece

Introduction

AI Translation

The AUP family of devices is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The LowestPower Family and Excellent Signal Integrity). This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input. NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

Features

AI Translation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22: 2000-V Human-Body Model (A114-B, Class II), 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption (IC C = 0.9 μA Maximum)
  • Low Dynamic-Power Consumption (ΔCpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot < 10% of VCC
  • Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Δtpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

Applications

AI Translation
  • Grid Infrastructure
  • PC & Notebooks
  • Tablets
  • Factory Automation & Control
  • Gaming Server