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ALLEGRO A1333LLETR-5-T

Manufacturer
MPN
A1333LLETR-5-T
LCSC Part #
C2153609
Packaging
TSSOP-14
Customer #
Key Attributes
Precision, High Speed, Hall-Effect Angle Sensor IC with Integrated Diagnostics for Safety-Critical Applications
DatasheetALLEGRO A1333LLETR-5-T
RoHS Compliance1 documents available
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategorySensors, Transducers/Position Sensors/Angle, Linear Position Measuring
ManufacturerALLEGRO
PackagingTSSOP-14
Operating Temperature-40℃~+150℃
Number of Conjugate Points of UVW16
Current - Supply17mA
FeaturesBuilt-in self-test (BIST);Incremental encoder output;Programmable hysteresis
Voltage - Supply4V~16.5V
Out TypeSPI;PWM
Number of ABZ Pulses2048
Rotate Speed15000rpm
Minimum Field-

Introduction

AI Translation

The A1333 is a 360° angle sensor IC that provides contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology. It has a system-onchip (SoC) architecture that includes: a CVH front end, digital signal processing, and motor commutation (UVW) or encoder outputs (A, B, I). It also includes on-chip EEPROM technology, capable of supporting up to 100 read/write cycles, for flexible end-of-line programming of calibration parameters. The A1333 is ideal for automotive applications requiring 0° to 360° angle measurements, such as electronic power steering (EPS), rotary PRNDLs, and throttle systems. The A1333 supports customer integration into safety-critical applications. The A1333 is available in a dual-die 24-pin eTSSOP and a single-die 14-pin TSSOP package. The packages are lead (Pb) free with 100% matte-tin leadframe plating.

Features

AI Translation
  • Contactless 0° to 360° angle sensor IC, for angular position, rotational speed, and direction measurement
  • Capable of sensing magnet rotational speeds targeting 12b effective resolution with 900 G field
  • Circular Vertical Hall (CVH) technology provides a single channel sensor system supporting operation across a wide range of air gaps
  • Developed in accordance with ISO 26262:2011 requirements for hardware product development for use in safety-critical applications
  • Single die version designed to meet ASIL B requirements when integrated and used in conjunction with the appropriate system-level control, in the manner prescribed in the A1333 Safety Manual
  • Dual die version designed to meet ASIL D requirements when integrated and used in conjunction with the appropriate system-level control, in the manner prescribed in the A1333 Safety Manual
  • High diagnostic coverage
  • On-chip diagnostics include logic built-in self-test (LBIST), signal path diagnostics, and watchdogs to support safety-critical (ASIL) applications
  • 4-bit CRC on SPI
  • On-chip EEPROM for storing factory and customer calibration parameters
  • Single-bit error correction, dual-bit error detection through the use of error correction control (ECC)
  • Supports harsh operating conditions required for automotive and industrial applications, including direct connection to 12 V battery
  • Operating temperature range from -40℃ to 150℃
  • Operating supply voltage range from 4.0 to 16.5 V
  • Can support ISO 7637-2 Pulse 5b up to 39 V
  • Multiple output formats supported for ease of system integration
  • ABI/UVW output provides high resolution, low latency, and PWM for initial position
  • 10 MHz SPI for low latency angle and diagnostic information; enables multiple independent ICs to be connected to the same bus
  • Output resolution on ABI and UVW are selectable
  • Multiple programming / configuration formats supported
  • The system can be completely controlled and programmed over SPI, including EEPROM writes
  • For system with limited pins available, writing and reading can be performed over VCC and PWM pins. This allows configuring the EEPROM in production line for a device with only ABI/UVW and PWM pins connected.
  • Stacked dual die construction to improve die-to-die matching for systems that require redundant sensors
  • Reduces magnet misalignment impact on die-to-die matching for a given magnet diameter, relative to “side-by-side” dual die orientation