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TI BUF634AIDRRoHS

Manufacturer
MPN
BUF634AIDR
LCSC Part #
C2058426
Packaging
SOIC-8
Customer #
Key Attributes
36V, high-speed, high-current output buffer
Datasheetpdf iconTI BUF634AIDR

Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Linear/Amplifiers/Instrumentation, Op Amps, Buffer Amps
ManufacturerTI
PackagingSOIC-8
Number of Channels1
Vos - Input Offset Voltage36mV
Slew Rate3.75V/ns
Input Offset Current(Ios)-
Input offset current drift(Ios TC)-
FeaturesESD protection
Operating Temperature-40℃~+125℃
Common Mode Rejection Ratio(CMRR)-
Ib - Input Bias Current250nA
Maximum Power Supply Range (Vdd-Vss)36V
Input Offset Voltage Drift(Vos TC)175uV/℃
Quiescent Current8.5mA
Gain Bandwidth Product210MHz
Input Voltage Noise Density20nV/√Hz@1kHz
Output Current250mA
Dual Supply-18V~-2.25V;2.25V~18V
Rail to Rail-
Single Supply-

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging2500
Sales UnitPiece

Introduction

AI Translation

The BUF634A device is a high-performance, high-fidelity open-loop buffer capable of driving an output current of 250mA. The BUF634A is a 36V device, and its bandwidth can be adjusted in the range of 35MHz to 210MHz by changing the value of the external resistor between the V– and BW pins. The BUF634A device can be used as an independent open-loop driver or inside the feedback loop of a precision operational amplifier to provide higher capacitive load driving capability for high-precision drivers and large-output-current drivers. For low-power applications, the BUF634A device features an operating quiescent current of 1.5mA, an output of 250mA, a slew rate of 3750V/µs, and a bandwidth of 35MHz. This device consumes a quiescent current of 8.5mA in the wide-bandwidth mode with a bandwidth of 210MHz. The BUF634A is fully protected by internal current limiting in its output stage and thermal shutdown, making it highly durable and easy to use. The BUF634A device can operate normally in the industrial temperature range from -40°C to +125°C. The BUF634A is available in three packages: D (SOIC), DRB (VSON), and DDA (HSOIC). The DRB (VSON) and DDA (HSOIC) packages have thermal pads on the bottom, thus offering excellent thermal performance. The DRB package has a very small form factor of only 3.0mm×3.0mm, making the device well-suited for portable and size-constrained applications.

Features

AI Translation
  • Pin-selectable bandwidth: 35MHz to 210MHz
  • High output current: 250mA
  • Slew rate: 3750V/µs
  • Low quiescent current: 1.5mA (35MHz BW)
  • Wide supply voltage range: ±2.25V to ±18V
  • Internal output current limiting
  • Thermal shutdown protection
  • Package with exposed thermal pad available
  • Operating temperature range: –40°C to +125°C

Applications

AI Translation
  • Memory, semiconductor testers
  • Test equipment
  • Headphone drivers
  • Capacitive load drivers
  • Valve drivers, solenoid drivers
  • Line drivers
In-Stock: 7,540
7,540 In stock, ships now
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 3.3939$ 3.39
10+$ 3.008$ 30.08
30+$ 2.8117$ 84.35
100+$ 2.5474$ 254.74
500+$ 2.4534$ 1226.70
1,000+$ 2.4129$ 2412.90
Standard Packaging2500/Full Reel
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