ISSI IS43DR16320C-25DBI-TR
| Fabricante | ISSIAsian Brands |
| N.º de pieza fab. | IS43DR16320C-25DBI-TR |
| Nº LCSC | C20543154 |
| Emb. | 84-TWBGA (8x12.5) |
| Número de Cliente | |
| Atrib. clave | 512Mbit 1.7V~1.9V 400MHz DDR2 SDRAM 84-TWBGA (8x12.5) Memory RoHS |
| Hoja de Datos | ISSI IS43DR16320C-25DBI-TR |
| Piezas alternativas | 20 |
Especificaciones del Producto
| Tipo | Descripción | |
|---|---|---|
| Categoría | Integrated Circuits (ICs)/Memory/Memory | |
| Fabricante | ISSI | |
| Emb. | 84-TWBGA (8x12.5) | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Built-in phase-locked loop;Auto precharge function;Data mask function;Dynamic on-chip termination | |
| Refresh Current | 3mA | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM | |
| Current - Supply | 135mA |
| Tipo | Descripción | |
|---|---|---|
| Categoría | Integrated Circuits (ICs)/Memory/Memory | |
| Fabricante | ISSI | |
| Emb. | 84-TWBGA (8x12.5) | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Built-in phase-locked loop;Auto precharge function;Data mask function;Dynamic on-chip termination | |
| Refresh Current | 3mA |
| Tipo | Descripción | |
|---|---|---|
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM | |
| Current - Supply | 135mA |
Descripción
ISSI's 512Mb DDR2 SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the 1/O balls. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the active command are used to select the bank and row to be accessed (BA0 - BA1 select the bank; A0 - A12(x16) or A0 - A13(x8) select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location A0 - A9 for the burst access and to determine if the auto precharge A10 command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized.
Características
- VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V
- JEDEC standard 1.8V I/O (SSTL_18-compatible) Double data rate interface: two data transfers per clock cycle Differential data strobe (DQS, DQS) 4-bit prefetch architecture On chip DLL to align DQ and DQS transitions with CK
- 4 internal banks for concurrent operation
- Programmable CAS latency (CL) 3, 4, 5, and 6 supported
- Posted CAS and programmable additive latency (AL) 0, 1, 2, 3, 4, and 5 supported WRITE latency = READ latency - 1 tCK
- Programmable burst lengths: 4 or 8
- Adjustable data-output drive strength, full and reduced strength options
- On-die termination (ODT)
| Cant. | Prec. unit.(Solo como referencia) | Importo total |
|---|---|---|
| 1+ | $ 17.0763 | $ 17.08 |
| 200+ | $ 6.8135 | $ 1362.70 |
| 500+ | $ 6.5872 | $ 3293.60 |
| 1,000+ | $ 6.4733 | $ 6473.30 |
Encapsulado Estándar2500/Full Bag | ||
Especificaciones del Producto
| Tipo | Descripción | |
|---|---|---|
| Categoría | Integrated Circuits (ICs)/Memory/Memory | |
| Fabricante | ISSI | |
| Emb. | 84-TWBGA (8x12.5) | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Built-in phase-locked loop;Auto precharge function;Data mask function;Dynamic on-chip termination | |
| Refresh Current | 3mA | |
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM | |
| Current - Supply | 135mA |
| Tipo | Descripción | |
|---|---|---|
| Categoría | Integrated Circuits (ICs)/Memory/Memory | |
| Fabricante | ISSI | |
| Emb. | 84-TWBGA (8x12.5) | |
| Operating Temperature | -40℃~+95℃ | |
| Features | Built-in phase-locked loop;Auto precharge function;Data mask function;Dynamic on-chip termination | |
| Refresh Current | 3mA |
| Tipo | Descripción | |
|---|---|---|
| Memory Size | 512Mbit | |
| Voltage - Supply | 1.7V~1.9V | |
| Clock Frequency | 400MHz | |
| Memory Format | DDR2 SDRAM | |
| Current - Supply | 135mA |
Descripción
ISSI's 512Mb DDR2 SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data rate architecture is essentially a 4n-prefetch architecture, with an interface designed to transfer two data words per clock cycle at the 1/O balls. Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the active command are used to select the bank and row to be accessed (BA0 - BA1 select the bank; A0 - A12(x16) or A0 - A13(x8) select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location A0 - A9 for the burst access and to determine if the auto precharge A10 command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized.
Características
- VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V
- JEDEC standard 1.8V I/O (SSTL_18-compatible) Double data rate interface: two data transfers per clock cycle Differential data strobe (DQS, DQS) 4-bit prefetch architecture On chip DLL to align DQ and DQS transitions with CK
- 4 internal banks for concurrent operation
- Programmable CAS latency (CL) 3, 4, 5, and 6 supported
- Posted CAS and programmable additive latency (AL) 0, 1, 2, 3, 4, and 5 supported WRITE latency = READ latency - 1 tCK
- Programmable burst lengths: 4 or 8
- Adjustable data-output drive strength, full and reduced strength options
- On-die termination (ODT)
C20543154 Biblioteca EasyEDA
Cumplimiento & Códigos de Exportación
| Tipo | Detalles |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | EAR99 |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Tipo | Detalles |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | EAR99 |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Tipo | Detalles |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
Piezas alternativas
| MPN | Fabricante | Empaque | Disponibilidad | Precio unitario | ||
|---|---|---|---|---|---|---|
| IS43DR16320D-25DBLI | ISSI | TWBGA-84(8x12.5) | 6 | $ 16.1225 | ||
| IS43DR16320C-25DBLI-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 13.7654 | ||
| IS43DR16320C-25DBI | ISSI | 84-TWBGA (8x12.5) | 0 | $ 19.9165 | ||
| IS46DR16320C-25DBLA1 | ISSI | TWBGA-84(8x12.5) | 0 | $ 15.9157 | ||
| IS46DR16320C-25DBLA1-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 17.3037 | ||
| IS43DR16320C-25DBL-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 9.6835 | ||
| IS43DR16320C-25DBL | ISSI | TWBGA-84(8x12.5) | 0 | $ 9.3456 | ||
| IS46DR16320E-25DBLA1 | ISSI | TWBGA-84(8x12.5) | 0 | $ 5.6306 | ||
| IS46DR16320D-25DBLA1 | ISSI | TWBGA-84(8x12.5) | 0 | $ 13.2602 | ||
| IS46DR16320D-25DBLA1-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 16.3434 | ||
| IS43DR16320E-25DBLI-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 4.9502 | ||
| IS43DR16320D-25DBLI-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 13.128 | ||
| IS46DR16320E-25DBLA2 | ISSI | TWBGA-84(8x12.5) | 0 | $ 6.4672 | ||
| IS46DR16320D-25DBLA2-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 19.6135 | ||
| IS46DR16320D-25DBLA2 | ISSI | TWBGA-84(8x12.5) | 0 | $ 16.5742 | ||
| IS46DR16320E-25DBLA2-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 5.6772 | ||
| IS46DR16320E-25DBLA1-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 5.0135 | ||
| IS43DR16320D-25DBL-TR | ISSI | TWBGA-84(8x12.5) | 0 | $ 7.225 | ||
| IS43DR16320D-25DBL | ISSI | TWBGA-84(8x12.5) | 0 | $ 5.454 | ||
| IS43DR16320E-25DBL | ISSI | TWBGA-84(8x12.5) | 0 | $ 6.0284 |

