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MICROCHIP 1N5954BUR-1/TR

Fabricante
N.º de pieza fab.
1N5954BUR-1/TR
Nº LCSC
C20289876
Emb.
DO-213AB(MELF,LL41)
Número de Cliente
Atrib. clave
1 Independent 160V DO-213AB(MELF,LL41) Single Zener Diodes
Hoja de DatosMICROCHIP 1N5954BUR-1/TR
Agotado
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Mínimo: 1Múltiplo: 1Unidad de venta: Piece
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Cant.Prec. unit.(Solo como referencia)Importo total
1+$ 19.1799$ 19.18
250+$ 7.6535$ 1913.38
500+$ 7.3983$ 3699.15
1,000+$ 7.2722$ 7272.20
Encapsulado Estándar125/Full Reel
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Especificaciones del Producto

Todo
TipoDescripción
CategoríaDiscrete Semiconductors/Diodes/Zener/Single Zener Diodes
FabricanteMICROCHIP
Emb.DO-213AB(MELF,LL41)
Diode Configuration1 Independent
Tolerance±5%
Operating Junction Temperature Range-65℃~+175℃
Pd - Power Dissipation1.5W
Reverse Leakage Current (Ir)1uA@121.6V
Impedance(Zzt)700Ω
Zener Voltage(Range)-
Zener Voltage(Nom)160V
Impedance(Zzk)6.5kΩ

Descripción

Traducción por IA

This series of 1.5W surface-mount Zener diodes in JEDEC DO-213AB packages features electrical characteristics similar to the JEDEC-registered 1N5913B through 1N5956B axial-lead packages (3.3V to 200V). It is ideal for high-density and low-parasitic applications. Thanks to its glass-sealed construction and metallurgically bonded internal contacts, it is also suitable for high-reliability applications when required by a Source Control Drawing (SCD) or when screened per MIL-PRF-19500 as described in the characteristics below.

Características

Traducción por IA
  • Surface-mount equivalent to JEDEC-registered 1N5913B through 1N5956B series axial-lead diodes.
  • Zener voltage range: 3.3V to 200V.
  • Available in 10%, 5%, 2%, and 1% voltage tolerances.
  • Screenable per MIL-PRF-19500 (see part nomenclature for all available options).
  • RoHS-compliant versions available.

Aplicaciones

Traducción por IA
  • Voltage regulation across wide operating current and temperature ranges.
  • Leadless package ideal for high-density SMT.
  • Metallurgically enhanced internal contact design for improved reliability and reduced thermal resistance.
  • Glass-sealed hermetic package.
  • Insensitive to ESD per MIL-STD-750 Method 1020.
  • Capacitance specified (see Figure 2).
  • Inherent radiation hardness as described in Microsemi MicroNote 050.