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Everspin Tech EM008LXQADG13IS1T product image
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Everspin Tech EM008LXQADG13IS1T

Manufacturer
MPN
EM008LXQADG13IS1T
LCSC Part #
C17466445
Packaging
DFN-8(6x8)
Customer #
Key Attributes
8Mbit MRAM SPI DFN-8(6x8) Memory RoHS
DatasheetEverspin Tech EM008LXQADG13IS1T
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QtyUnit Price(Reference Only)Total Amount
1+$ 18.5575$ 18.56
290+$ 7.4047$ 2147.36
580+$ 7.1582$ 4151.76
870+$ 7.0349$ 6120.36
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Memory/Memory
ManufacturerEverspin Tech
PackagingDFN-8(6x8)
Operating Temperature-
FeaturesPower-up/power-down/under-voltage data protection function;Dedicated OTP region function;Interrupt status indication function;Write enable latch function;Software write protection function;Block protection function;Hardware write protection function;Write protection function
Memory Size8Mbit
Voltage - Supply-
Memory FormatMRAM
InterfaceSPI

Introduction

AI Translation

The EMxxLX is the industry’s first xSPI serial interface persistent memory based on unique industrial STT MRAM technology. It is a high-performance, multiple I/O, SPI-compatible MRAM device featuring a high-speed, low pin count SPI compatible bus interface with a clock frequency of up to 200 MHz and a single 1.8V power supply. The EM064LX delivers up to 400MBps reads and writes via eight I/O signals with a clock frequency of 200MHz. A new era of universal memory applications is enabled with the EMxxLX, replacing products such as SRAM, BBSRAM, NVSRAM and over-provisioned NOR devices.

Features

AI Translation
  • Expanded SPI bus interface supporting Octal, Quad, Dual and Single SPI protocol
  • Up to 200MHz single and double transfer rate (STR/DTR) for Octal SPI
  • Unlimited read and write operations
  • JEDEC compliant: JESD251, JESD251-1
  • Byte level writes and reads with no erase required in persistent memory operating mode
  • High Data integrity: No external ECC required.
  • SPI backwards compatibility: NVSRAM, FRAM, NOR, Toggle MRAM
  • SPI, xSPI Commands for Program/Erase emulated NOR compatible Execute-in-place (XIP)
  • Densities available: 8Mb, 16Mb, 32Mb, 64Mb
  • 400MBps sustained throughput with OSPI at 200MHz, DTR, for reads and writes
  • JEDEC standard, RoHS compliant packages: 24-ball BGA, 6mm x 8mm (5 x 5 array); 8-pin DFN, 6mm x 8mm
  • Operating temperature range: Commercial: 0℃ to +70℃; Industrial: -40℃ to +85℃

Applications

AI Translation
  • Industrial IoT
  • Process Automation and Control
  • FPGA Configuration
  • Medical
  • Gaming
  • Scramming Memory
  • Continuous Ring Buffers
  • WriteBuffer
  • Data Logging
  • Journaling
  • Code Storage & Execution
  • Boot Load Configuration
  • DataRAM
  • InstantFPGA Re-Configurability