MXIC MX30LF2GE8AB-TI

Manufacturer	MXIC
MPN	MX30LF2GE8AB-TI
LCSC Part #	C17317721
Packaging	TFSOP-48-18.4mm
Customer #
Key Attributes	2Gbit 2.7V~3.6V Parallel TFSOP-48-18.4mm Memory RoHS
Datasheet	MXIC MX30LF2GE8AB-TI

Products Specifications

All

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	MXIC
Packaging	TFSOP-48-18.4mm
Operating Temperature	-40℃~+85℃
Features	Read buffer function;Software reset function;Bad block management function;ECC error correction function;OTP region write protection and lock function;Hardware write protection function
Memory Size	2Gbit
Voltage - Supply	2.7V~3.6V
Program / Erase Cycles	-
Clock Frequency	-
Data Retention - TDR (Year)	10 years
Block Erase Time(tBE)	1ms
Page Programming Time (Tpp)	20ns
Write Cycle Time(tWC)	20ns
Standby Supply Current	-
Interface	Parallel

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	MXIC
Packaging	TFSOP-48-18.4mm
Operating Temperature	-40℃~+85℃
Features	Read buffer function;Software reset function;Bad block management function;ECC error correction function;OTP region write protection and lock function;Hardware write protection function
Memory Size	2Gbit
Voltage - Supply	2.7V~3.6V
Program / Erase Cycles	-

AI Translation

1G-bit SLC NAND Flash
Bus: x8
Page size: (2048 + 64) byte
Block size: (128K + 4K) byte
ONFI 1.0 compliant
Multiplexed Command/Address/Data
User Redundancy: 64-byte attached to each page
Fast Read Access
Latency of array to register: 25us
Sequential read: 20ns
Cache Read Support
Page Program Operation
Page program time: 300us (typ.)
Cache Program Support
Block Erase Operation
Block erase time: 1ms (typ.)
Single Voltage Operation: VCC: 2.7 - 3.6V
Low Power Dissipation
Max. 30mA Active current (Read/Program/Erase)
Sleep Mode: 50uA (Max) standby current
Hardware Data Protection: WP# pin
Block Protection: PT (Protection) pin: active high at power-on, which protects the entire chip. The pin has an internal weak pull down.
Temporary protection/un-protection function (enabling by PT pin)
Solid protection (enabling by PT pin)
Device Status Indicators: Ready/Busy

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement

All

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	MXIC
Packaging	TFSOP-48-18.4mm
Operating Temperature	-40℃~+85℃
Features	Read buffer function;Software reset function;Bad block management function;ECC error correction function;OTP region write protection and lock function;Hardware write protection function
Memory Size	2Gbit
Voltage - Supply	2.7V~3.6V
Program / Erase Cycles	-
Clock Frequency	-
Data Retention - TDR (Year)	10 years
Block Erase Time(tBE)	1ms
Page Programming Time (Tpp)	20ns
Write Cycle Time(tWC)	20ns
Standby Supply Current	-
Interface	Parallel

Type	Description
Category	Integrated Circuits (ICs)/Memory/Memory
Manufacturer	MXIC
Packaging	TFSOP-48-18.4mm
Operating Temperature	-40℃~+85℃
Features	Read buffer function;Software reset function;Bad block management function;ECC error correction function;OTP region write protection and lock function;Hardware write protection function
Memory Size	2Gbit
Voltage - Supply	2.7V~3.6V
Program / Erase Cycles	-

AI Translation

1G-bit SLC NAND Flash
Bus: x8
Page size: (2048 + 64) byte
Block size: (128K + 4K) byte
ONFI 1.0 compliant
Multiplexed Command/Address/Data
User Redundancy: 64-byte attached to each page
Fast Read Access
Latency of array to register: 25us
Sequential read: 20ns
Cache Read Support
Page Program Operation
Page program time: 300us (typ.)
Cache Program Support
Block Erase Operation
Block erase time: 1ms (typ.)
Single Voltage Operation: VCC: 2.7 - 3.6V
Low Power Dissipation
Max. 30mA Active current (Read/Program/Erase)
Sleep Mode: 50uA (Max) standby current
Hardware Data Protection: WP# pin
Block Protection: PT (Protection) pin: active high at power-on, which protects the entire chip. The pin has an internal weak pull down.
Temporary protection/un-protection function (enabling by PT pin)
Solid protection (enabling by PT pin)
Device Status Indicators: Ready/Busy