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TI DM505LRBABF

Manufacturer
MPN
DM505LRBABF
LCSC Part #
C1557247
Packaging
FCBGA-367
Customer #
Key Attributes
Floating-point 745MHz FCBGA-367 DSP (Digital Signal Processors) RoHS
DatasheetTI DM505LRBABF
RoHS Compliance1 documents available
Alternative Parts3
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/DSP (Digital Signal Processors)
ManufacturerTI
PackagingFCBGA-367
TypeFloating-point
Operating Temperature-40℃~+125℃
FeaturesHardware MAC acceleration;Parallel data channel;DMA data transfer;High-speed peripheral interface;Integrated ADC interface;Integrated PWM control;Multi-core cooperative processing
Clock Rate745MHz

Introduction

AI Translation

The DM505 is a highly optimized device for vision analytics and machine vision processing in industrial products such as drones, robotics, forklifts, railway, and agricultural equipment. This processor combines the best attributes of real-time performance, low power consumption, small form factor, and camera processing capability to enable complex embedded vision processing, allowing systems to interact with the physical world and the people in it in smarter, more meaningful ways.

The DM505 features a heterogeneous scalable architecture incorporating a combination of TI's fixed- and floating-point TMS320C66x DSP generation cores, Vision AccelerationPac (EVE), and dual Cortex-M4 processors. The device enables low-power designs to meet stringent embedded system budgets without compromising real-time processing performance, supporting compact designs. The DM505 also integrates a rich set of peripherals, including multi-camera input interfaces (parallel and serial), display output, audio and serial I/O, CAN, and Gigabit Ethernet AVB.

Features

AI Translation
  • Architecture designed for vision analytics applications
  • Video and image processing support – Full HD video (1920×1080, 60fps), video input and video output
  • Up to 2 C66x floating-point VLIW DSPs, fully object-code compatible with C67x and Gfx+, up to 32 16×16-bit fixed-point multiplications per cycle
  • Up to 512kB on-chip L3 RAM
  • L3 and L4 interconnect memory interface (EMIF) modules supporting DDR3/DDR3L up to DDR-1066, DDR2 up to DDR-800, LPDDR2 up to DDR-667, maximum 2GB
  • Dual Arm Cortex-M4 image processing unit (IPU), Vision AccelerationPac, embedded vision engine (EVE)
  • Display subsystem with display controller using DMA engine
  • CVIDEO/SD-DAC TV analog composite output
  • Video input port (VIP) module supporting up to 4 multiplexed input ports
  • On-chip temperature sensor with temperature alarm generation
  • General-purpose memory controller (GPMC)
  • Enhanced direct memory access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller area network (DCAN) module, CAN 2.0B protocol
  • Modular controller area network (MCAN) module, CAN 2.0B protocol
  • 8× 32-bit general-purpose timers
  • 3 configurable UART modules
  • 4 McSPI with quad-channel SPI interface
  • Two I²C ports
  • Three McASP modules
  • MMC/SD/SDIO interface
  • Up to 126 GPIO pins
  • Power, reset, and clock management
  • On-chip debug with CTool technology
  • AEC-Q100 automotive-grade compliant
  • Safety IP in 15×15mm, 0.65mm pitch, 367-pin PBGA (ABF)
  • 8-channel 10-bit ADC
  • MIPI CSI-2 camera serial interface
  • PWMSS
  • Full HW image pipeline: DPC, CFA, 3D-NF, RGB-YUV, WDR, HW LDC, and perspective

Applications

AI Translation
  • Drone robotics
  • Industrial transport (forklifts, rail, and agriculture)
  • Factory and building automation cameras