Infineon S26HL01GTFPBHM033
| Hersteller | |
| Herst.-Teilenr. | S26HL01GTFPBHM033 |
| LCSC-Nr. | C6472074 |
| Verp. | FBGA-24(8x8) |
| Kundennummer | |
| Hauptmerkm. | 1Gbit 2.7V~3.6V 166MHz SPI FBGA-24(8x8) Memory RoHS |
| Datenblatt | |
| Alternative Teile | 20 |
Produktspezifikationen
Alle
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | Infineon | |
| Verp. | FBGA-24(8x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Power-on reset;ECC error correction | |
| Memory Size | 1Gbit | |
| Voltage - Supply | 2.7V~3.6V | |
| Program / Erase Cycles | 2,560,000 Cycles | |
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | 1.7ms | |
| Interface | SPI | |
| Standby Supply Current | 0.014mA |
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | Infineon | |
| Verp. | FBGA-24(8x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Power-on reset;ECC error correction | |
| Memory Size | 1Gbit | |
| Voltage - Supply | 2.7V~3.6V | |
| Program / Erase Cycles | 2,560,000 Cycles |
| Typ | Beschreibung | |
|---|---|---|
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | 1.7ms | |
| Interface | SPI | |
| Standby Supply Current | 0.014mA |
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Merkmale
KI-Übersetzung
- 45nm MIRRORBIT technology, storing two data bits per memory array cell
- Sector architecture options: uniform architecture (address space consisting of all 256KB sectors) and hybrid architecture (configuration 1: address space consisting of thirty-two 4KB sectors located at top or bottom, with remaining sectors at 256KB; configuration 2: address space consisting of thirty-two 4KB sectors evenly distributed at top and bottom, with remaining sectors at 256KB)
- Page program buffer of 256 or 512 bytes
- 1024-byte (32×32 bytes) one-time programmable secure silicon region
- HYPERBUS interface: JEDEC extended SPI standard compatible; DDR option operating at up to 400MBps (200MHz clock speed); data strobe support for simplified read data capture in high-speed systems
- Legacy (x1) SPI interface: JEDEC extended SPI standard compatible; SDR option operating at up to 21MBps (166MHz clock speed)
- Default boot mode support for legacy SPI (x1) or HYPERBUS interface (x8)
- Functional safety features: ISO26262 ASIL B compliant and ASIL D ready; high endurance and long retention partition; interface CRC for communication error detection between host controller and device; data integrity CRC for memory array error detection; secure boot reporting device initialization failures, detecting configuration corruption, and providing recovery options; built-in ECC for single-bit error correction and double-bit error detection in memory array data; sector erase status indicator for power loss during erase
- Protection features: advanced sector protection based on individual memory array sectors; auto-boot for immediate memory array access after power-up; hardware reset via CS# signal method (JEDEC) and dedicated RESET# pin; Serial Flash Discoverable Parameters describing device capabilities and characteristics; device ID, manufacturer ID, and identification
- Data integrity: minimum 640,000 program-erase cycles for 256Mb device main array; minimum 1,280,000 program-erase cycles for 512Mb device main array; minimum 2,560,000 program-erase cycles for 1Gb device main array; minimum 300,000 program-erase cycles for 4KB sectors across all devices; minimum 25-year data retention
- Supply voltage: 1.7V to 2.0V (HS-T) and 2.7V to 3.6V (HL-T)
- Grade/temperature range: Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive AEC-Q100 Grade 3 (-40°C to +85°C), Automotive AEC-Q100 Grade 2 (-40°C to +105°C), Automotive AEC-Q100 Grade 1 (-40°C to +125°C)
- Package: 24-ball BGA 6×8mm package for 256Mb and 512Mb devices; 24-ball BGA 8×8mm package for 1Gb devices
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Zur BOM-Liste hinzufügen
| Stk. | E-Preis(Nur als Referenz) | Gesamtbetrag |
|---|---|---|
| 1+ | $ 51.4833 | $ 51.48 |
| 200+ | $ 20.5427 | $ 4108.54 |
| 500+ | $ 19.8562 | $ 9928.10 |
| 1,000+ | $ 19.5167 | $ 19516.70 |
Standardgehäuse2500/Full Reel | ||
Besserer Preis bei größerer Menge?
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Produktspezifikationen
Alle
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | Infineon | |
| Verp. | FBGA-24(8x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Power-on reset;ECC error correction | |
| Memory Size | 1Gbit | |
| Voltage - Supply | 2.7V~3.6V | |
| Program / Erase Cycles | 2,560,000 Cycles | |
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | 1.7ms | |
| Interface | SPI | |
| Standby Supply Current | 0.014mA |
| Typ | Beschreibung | |
|---|---|---|
| Kategorie | Integrated Circuits (ICs)/Memory/Memory | |
| Hersteller | Infineon | |
| Verp. | FBGA-24(8x8) | |
| Operating Temperature | -40℃~+125℃ | |
| Features | Power-on reset;ECC error correction | |
| Memory Size | 1Gbit | |
| Voltage - Supply | 2.7V~3.6V | |
| Program / Erase Cycles | 2,560,000 Cycles |
| Typ | Beschreibung | |
|---|---|---|
| Clock Frequency | 166MHz | |
| Data Retention - TDR (Year) | 25 Years | |
| Block Erase Time(tBE) | - | |
| Write Cycle Time(tWC) | - | |
| Page Programming Time (Tpp) | 1.7ms | |
| Interface | SPI | |
| Standby Supply Current | 0.014mA |
Fehler meldenÄhnliche Produkte anzeigen (0) >
Merkmale
KI-Übersetzung
- 45nm MIRRORBIT technology, storing two data bits per memory array cell
- Sector architecture options: uniform architecture (address space consisting of all 256KB sectors) and hybrid architecture (configuration 1: address space consisting of thirty-two 4KB sectors located at top or bottom, with remaining sectors at 256KB; configuration 2: address space consisting of thirty-two 4KB sectors evenly distributed at top and bottom, with remaining sectors at 256KB)
- Page program buffer of 256 or 512 bytes
- 1024-byte (32×32 bytes) one-time programmable secure silicon region
- HYPERBUS interface: JEDEC extended SPI standard compatible; DDR option operating at up to 400MBps (200MHz clock speed); data strobe support for simplified read data capture in high-speed systems
- Legacy (x1) SPI interface: JEDEC extended SPI standard compatible; SDR option operating at up to 21MBps (166MHz clock speed)
- Default boot mode support for legacy SPI (x1) or HYPERBUS interface (x8)
- Functional safety features: ISO26262 ASIL B compliant and ASIL D ready; high endurance and long retention partition; interface CRC for communication error detection between host controller and device; data integrity CRC for memory array error detection; secure boot reporting device initialization failures, detecting configuration corruption, and providing recovery options; built-in ECC for single-bit error correction and double-bit error detection in memory array data; sector erase status indicator for power loss during erase
- Protection features: advanced sector protection based on individual memory array sectors; auto-boot for immediate memory array access after power-up; hardware reset via CS# signal method (JEDEC) and dedicated RESET# pin; Serial Flash Discoverable Parameters describing device capabilities and characteristics; device ID, manufacturer ID, and identification
- Data integrity: minimum 640,000 program-erase cycles for 256Mb device main array; minimum 1,280,000 program-erase cycles for 512Mb device main array; minimum 2,560,000 program-erase cycles for 1Gb device main array; minimum 300,000 program-erase cycles for 4KB sectors across all devices; minimum 25-year data retention
- Supply voltage: 1.7V to 2.0V (HS-T) and 2.7V to 3.6V (HL-T)
- Grade/temperature range: Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive AEC-Q100 Grade 3 (-40°C to +85°C), Automotive AEC-Q100 Grade 2 (-40°C to +105°C), Automotive AEC-Q100 Grade 1 (-40°C to +125°C)
- Package: 24-ball BGA 6×8mm package for 256Mb and 512Mb devices; 24-ball BGA 8×8mm package for 1Gb devices
C6472074 EasyEDA-Bibliothek
Compliance & Exportcodes
| Typ | Details |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
| Typ | Details |
|---|---|
| RoHS | ROHS Compliant |
| ECCN | 3A991B1A |
| CNHTS | 8542329000 |
| USHTS | 8542320071 |
| TARIC | 8542329000 |
| Typ | Details |
|---|---|
| CAHTS | 8542330000 |
| BRHTS | 85423299 |
| INHTS | 85423200 |
| MXHTS | 8542.32.99 |
Alternative Teile
| MPN | Hersteller | Verpackung | Verfügbarkeit | Stückpreis | ||
|---|---|---|---|---|---|---|
| S28HL01GTFPBHM030 | Infineon | FBGA-24(8x8) | 0 | $ 54.6856 | ||
| S26HL01GTFPBHB020 | Infineon | FBGA-24(8x8) | 0 | $ 36.2759 | ||
| S26HL01GTFPBHV020 | Infineon | FBGA-24(8x8) | 0 | $ 37.0352 | ||
| S26HL01GTFPBHV023 | Infineon | FBGA-24(8x8) | 0 | $ 45.4924 | ||
| S26HL01GTFPBHI023 | Infineon | FBGA-24(8x8) | 0 | $ 36.8415 | ||
| S26HL01GTFPBHI033 | Infineon | FBGA-24(8x8) | 0 | $ 36.844 | ||
| S26HL01GTFPBHV033 | Infineon | FBGA-24(8x8) | 0 | $ 50.6504 | ||
| S26HL01GTFPBHV030 | Infineon | FBGA-24(8x8) | 0 | $ 37.0248 | ||
| S25HL01GTDPBHM030 | Infineon | FBGA-24(8x8) | 0 | $ 44.0088 | ||
| S25HL01GTFABHM033 | Infineon | FBGA-24(8x8) | 0 | $ 41.1372 | ||
| S25HL01GTFABHB030 | Infineon | FBGA-24(8x8) | 0 | $ 38.6386 | ||
| S25HL01GTDPBHB030 | Infineon | FBGA-24(8x8) | 0 | $ 37.134 | ||
| S28HL01GTFPBHB033 | Infineon | FBGA-24(8x8) | 0 | $ 48.6296 | ||
| S25HL01GTFABHV030 | Infineon | FBGA-24(8x8) | 0 | $ 32.2985 | ||
| S25HL01GTDPBHV030 | Infineon | FBGA-24(8x8) | 0 | $ 32.1879 | ||
| S25HL01GTFABHV033 | Infineon | FBGA-24(8x8) | 0 | $ 32.2963 | ||
| S25HL01GTDPBHB033 | Infineon | FBGA-24(8x8) | 0 | $ 36.1788 | ||
| S25HL01GTDPBHA030 | Infineon | FBGA-24(8x8) | 0 | $ 33.4806 | ||
| S28HL01GTFPBHI033 | Infineon | FBGA-24(8x8) | 0 | $ 36.8415 | ||
| S25HL01GTDPBHA033 | Infineon | FBGA-24(8x8) | 0 | $ 33.4806 |

