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VICOR BCM48BT096T240A00

Fabricante
N.º de pieza fab.
BCM48BT096T240A00
Nº LCSC
C6131380
Emb.
-
Número de Cliente
Atrib. clave
9.6V 38V~55V DC DC Converters RoHS
Hoja de DatosVICOR BCM48BT096T240A00
Cumplimiento RoHS1 documentos disponibles
Agotado
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Mínimo: 1Múltiplo: 1Unidad de venta: Piece
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Cant.Prec. unit.(Solo como referencia)Importo total
1+$ 221.6859$ 221.69
200+$ 88.4552$ 17691.04
500+$ 85.4988$ 42749.40
1,000+$ 84.0384$ 84038.40
Encapsulado Estándar25/Full Tray
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Especificaciones del Producto

Todo
TipoDescripción
CategoríaPower Supplies/Power Suppliers - Board Mount/DC DC Converters
FabricanteVICOR
Emb.-
Number of Outputs1
Iout30A
Output Voltage9.6V
Isolation Voltage(Vrms)2.25kV
FeaturesUnder Voltage Protection;Overvoltage protection;Over Current Protection;Short Circuit Protection;Over-temperature protection
Output Power240W
Voltage - Supply38V~55V
Conversion Efficiency95%

Descripción

Traducción por IA

The VI Chip bus converter is a high efficiency (>95%) Sine Amplitude Converter (SAC) operating from a 38 to 55V DC primary bus to deliver an isolated, ratiometric output voltage from 7.6 to 11.0V DC. The Sine Amplitude Converter offers a low AC impedance beyond the bandwidth of most downstream regulators; therefore capacitance normally at the load can be located at the input to the Sine Amplitude Converter. Since the transformation ratio of the BCM48Bx096y240A00 is 1/5, the capacitance value can be reduced by a factor of 25x, resulting in savings of board area, materials and total system cost. The BCM48BF096y240A00 is provided in a VI Chip package compatible with standard pick-and-place and surface mount assembly processes. The co-molded VI Chip package provides enhanced thermal management due to a large thermal interface area and superior thermal conductivity. The high conversion efficiency of the BCM48Bx096y240A00 increases overall system efficiency and lowers operating costs compared to conventional approaches.

Características

Traducción por IA
  • 48VDC - 9.6VDC 240W Bus Converter
  • High efficiency (>95%) reduces system power consumption
  • High power density (>817W/in³) reduces power system footprint by >40%
  • Contains built-in protection features:
    • Undervoltage
    • Overvoltage Lockout
    • Overcurrent Protection
    • Short circuit Protection
    • Overtemperature Protection
  • Provides enable/disable control, internal temperature monitoring
  • Can be paralleled to create multi-kW arrays

Aplicaciones

Traducción por IA
  • High End Computing Systems
  • Automated Test Equipment
  • High Density Power Supplies
  • Communications Systems