VISHAY NTCC201E4502HT

The thermistor is primarily intended for wire bonding or sintering. Contact specifications (thickness material) and bonding parameters can be provided upon request. Assembly process parameters should be selected according to the wire material. The mounting process shall comply with the following guidelines and recommendations: Die bonding: Reflow soldering under vacuum or using formic acid/forming gas, sintering with SAC or HMP/silver epoxy/nano-silver paste. Cleaning:

• Detergent spray
• Ultrasonic cleaning permitted if time is limited to within 5 minutes

• Flat chip top/bottom contacts (NTCC201E4 series)
• RoHS-compliant thermistor — no RoHS-exempted substances
• Wide temperature range from -55°C to +175°C (withstands repeated short-term high temperatures up to 200°C, e.g., 10 times for 10 seconds)
• High tolerance to mounting conditions
• Compatible with aluminum wire bonding
• Leach-resistant during reflow soldering
• Embossed tape packaging
• AEC-Q200 qualified
• Material Category: For compliance definitions, refer to www.vishay.com/doc?99912

• High-temperature sensing, control, and compensation in power semiconductor modules (e.g., IGBT, SiC MOSFET, diodes), EV/HEV inverters, and wind turbine generators
• IC and semiconductor protection
• Overtemperature protection in DC/AC power inverters and hybrid integrated circuits (HIC)